X-ray inspection system TR7600F3D SII

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Introduction
The TR7600F3D SII is an inline automated X-ray inspection (AXI) system designed for high-speed PCB inspection with imaging resolution down to 5 µm. It inspects large boards (up to 1000 x 660 mm for the LL SII variant) while maintaining production cycle time and reducing escapes and false calls.

Key features

• High-precision imaging: 5 µm — supports fine defect detection
• High throughput: next-generation mechanics delivering up to 20 FOV/s
• Inline fine-tuning: adjust multiple samples without stopping the line
• Industry connectivity: Smart Factory ready with MES integration and SMEMA compatibility

Imaging system

• Camera: Flat panel detector
• X-ray source voltage: 60–130 kV
• Imaging resolution range: 5 µm – 30 µm
• Inspection methods: 2D, 2.5D, 3D slicing; Planar CT optional

Motion table & control

• X/Y/Z axis: high-precision ballscrew with AC-servo controllers
• Optional dual-driven high-precision ballscrew (TR7600F3D LL SII)
• Mechanical design optimized for stable high-speed scanning

Board handling

• Max PCB size: TR7600F3D SII — 900 x 460 mm; TR7600F3D LL SII — 1000 x 660 mm
• PCB thickness: SII 0.6–7 mm; LL SII 0.4–7 mm
• Max PCB weight: 12 kg
• Clearances (top/bottom): Top @20/25/30 µm = 50 mm; @15 µm = 45 mm; @10 µm = 25 mm; @5 µm = 5 mm. Bottom @30 µm = 55 mm; @5/10/15/20/25 µm = 70 mm
• Edge clearance: 3 mm or 5 mm
• Conveyor height: 880–920 mm (optional 940–965 mm)
• SMEMA compatible

Inspection functions
Capabilities:

• Missing
• Misalignment
• Tombstone
• Billboard
• Tantalum polarity
• Rotation
• Floating

Defects detected:

• Insufficient / excess solder
• Bridging
• Open
• Solder ball
• Non-wetting
• Void
• Lifted lead

Dimensions & power

• Overall dimensions (WxDxH): SII 1470 x 1971 x 1974 mm; LL SII 1730 x 2300 x 1975 mm (excluding signal tower height 502 mm)
• Weight: SII 3850 kg; LL SII 4850 kg
• Power requirement: 200–240 VAC single phase, 50/60 Hz, 4 kVA

Technical specifications

• Model: TR7600F3D SII (option: TR7600F3D LL SII)
• Brand: Test Research, Inc. (TRI)
• Camera: Flat panel detector
• X-ray source voltage: 60–130 kV
• Imaging resolution: 5 µm – 30 µm
• Inspection methods: 2D, 2.5D, 3D slicing; Planar CT (optional)
• Max PCB size: 900 x 460 mm (SII) / 1000 x 660 mm (LL SII)
• PCB thickness: 0.6–7 mm (SII) / 0.4–7 mm (LL SII)
• Max PCB weight: 12 kg
• Motion control: high-precision ballscrew + AC-servo controller (optional dual-driven ballscrew)
• Throughput: up to 20 FOV/s
• Power: 200–240 VAC, single phase, 50/60 Hz, 4 kVA