X-ray inspection system TR7600FB SII

cameraAIautomated

Introduction
The TR7600FB SII is a next-generation Smart 3D AXI X-ray inspection system designed for clear imaging and advanced defect detection on large PCBs. Powered by AI inspection algorithms and AI-void detection, it balances high accuracy with production-line throughput for reduced escapes and false calls.

Features

• New X-ray imaging structure for improved image clarity
• AI inspection algorithms, AI-void detection and programming
• 5 μm high precision for comprehensive defect detection
• Next-generation mechanical design enabling speeds up to 20 FOV/s
• Inline fine-tuning on multiple samples without stopping production
• Smart-factory ready with MES connectivity

Applications

• Aerospace
• Advanced packaging
• Automotive
• Data centers
• IIoT
• Medical devices
• Mobile devices

Communication Standards

• SMEMA
• SECS/GEM
• IPC-CFX-2591
• IPC-HERMES-9852

Imaging System
Camera: Flat panel detector
X-ray source: 40–130 kV
Imaging resolution: 5 μm–30 μm
Inspection methods: 2D, 2.5D, 3D slicing, Planar CT (optional)

Motion Table & Control
X/Y/Z axes: high-precision ballscrew with AC-servo controllers
X-Y axis resolution: N/A

Board Handling
Max PCB size: 850 x 520 mm
PCB thickness: 0.4–7 mm
Max PCB weight: 12 kg
Top clearance: @30 μm: 60 mm; @25 μm: 80 mm; @20 μm: 90 mm; @15 μm: 90 mm; @10 μm: 90 mm; @5 μm: 90 mm
Bottom clearance: @30 μm: 50 mm; @25 μm: 50 mm; @20 μm: 50 mm; @15 μm: 40 mm; @10 μm: 20 mm; @5 μm: 10 mm
Edge clearance: 3 mm or 5 mm
Conveyor height: 880–920 mm (optional: 940–965 mm)

Inspection Functions
Capabilities

• BGAs, backdrill, barrel fill, capacitors, resistors, chips
• Components under RF shields, WLCSP, DIMM connectors, flip-chips, flip-chip ground pads
• Gullwing, heat sinks, J-leads, LED chips, LGAs
• Paladin connector, RNET, SiP, SMT connectors, SOIC, SOT
• Thermal pad, QFN, QFP and THT components

Detectable Defects

• Missing
• Misalignment
• Tombstone
• Billboard
• Tantalum polarity
• Rotation
• Foreign material
• Insufficient/excess solder
• Bridging
• Open
• Solder ball
• Non-wetting
• Void
• Lifted lead

Dimensions
WxDxH: 1550 x 2240 x 1800 mm (excluding signal tower; tower height: 519.5 mm)
Weight: 3770 kg
Power requirement: 200–240 VAC, single phase, 50/60 Hz, 4 kVA

Technical specifications

• Model: TR7600FB SII
• Camera: Flat panel detector
• X-ray source: 40–130 kV
• Imaging resolution: 5 μm–30 μm
• Inspection methods: 2D, 2.5D, 3D slicing, Planar CT (optional)
• High precision: 5 μm
• Max board size: 850 x 520 mm
• PCB thickness range: 0.4–7 mm
• Max PCB weight: 12 kg
• Top/Bottom clearances: see detailed values above
• Edge clearance: 3 mm or 5 mm
• Conveyor height: 880–920 mm (option 940–965 mm)
• Motion control: high-precision ballscrew with AC-servo controller (X/Y/Z)
• Inspection speed: up to 20 FOV/s
• Dimensions (WxDxH): 1550 x 2240 x 1800 mm
• Weight: 3770 kg
• Power: 200–240 VAC, single phase, 50/60 Hz, 4 kVA