X-ray inspection system TR7600F3D LL SII

camera3Dcomputed tomography

Introduction
The TR7600F3D LL SII is a high-speed 3D Automated X-ray Inspection (AXI) system with Planar CT capability, engineered for large PCB inspection up to 1000 x 660 mm. It reduces escapes and false calls while maintaining production cycle time.

Features

• Smart 3D AXI solution for large board inspection up to 1000 x 660 mm
• Imaging options down to 5 µm resolution for detailed defect detection
• Next-generation mechanical design enabling speeds up to 20 FOV/s
• Industry 4.0 ready with straightforward MES connectivity

Imaging System
Camera: Flat Panel Detector
X-ray Source: 130 kV Max (user adjustable)
Available Imaging Resolutions: 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm
Inspection Methods: 2D, 2.5D, 3D Slicing, Planar CT (optional)

Motion Table & Control
X-Axis Control: High-Precision Ballscrew + AC-Servo Controller
Y-Axis Control: High-Precision Ballscrew + AC-Servo Controller
Z-Axis Control: High-Precision Ballscrew + AC-Servo Controller
X-Y Axis Resolution: N/A

Board Handling
Max PCB Size: 1000 x 660 mm (effective max depends on angle of incidence)
PCB Thickness: 0.4 - 7 mm
Max PCB Weight: 12 kg
Top Clearance: @ 20/25/30 μm: 50 mm; @ 15 μm: 45 mm; @ 10 μm: 25 mm; @ 5 μm: 5 mm
Bottom Clearance: @ 30 μm: 55 mm; @ 5/10/15/20/25 μm: 70 mm
Edge Clearance: 3 mm or 5 mm
Conveyor Height: 880 - 920 mm (SMEMA compatible)

Inspection Functions
Capabilities:

• Missing component detection
• Misalignment
• Tombstone
• Billboard
• Tantalum polarity
• Rotation
• Floating components

Defects detected:

• Insufficient / Excess solder
• Bridging
• Open circuits
• Solder balls
• Non-wetting
• Voids
• Lifted leads

Dimensions
WxDxH: 1730 x 2300 x 1975 mm (tower not included; tower height: 502 mm)
Weight: 4850 kg
Power Requirement: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA

Technical specifications

• Model: TR7600F3D LL SII
• Imaging camera: Flat Panel Detector
• X-ray source: 130 kV Max (user adjustable)
• Imaging resolutions: 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm
• Inspection methods: 2D, 2.5D, 3D Slicing, Planar CT (optional)
• Maximum speed: up to 20 FOV/s (mechanical design)
• Motion control: High-Precision Ballscrew + AC-Servo Controller (X, Y, Z)
• PCB handling: Max PCB size 1000 x 660 mm; thickness 0.4 - 7 mm; max weight 12 kg
• Clearances: Top and bottom clearances vary by resolution (see details above); edge clearance 3 mm or 5 mm
• Conveyor height: 880 - 920 mm (SMEMA compatible)
• Key inspection capabilities: component presence/placement, solder inspection (insufficient/excess), bridging, open, solder ball, non-wetting, voids, lifted leads, tombstone, misalignment, rotation, billboard, tantalum polarity, floating
• Dimensions (WxDxH): 1730 x 2300 x 1975 mm
• Weight: 4850 kg
• Power: 200 - 240 VAC single phase, 50/60 Hz, 4 kVA