CCD inspection system TR7600LL SIII

X-ray3Dcomputed tomography

Introduction
The TR7600LL SIII CT AXI series is a next-generation inline PCBA computed tomography X-ray inspection system. Designed for 100% inspection coverage of very large printed circuit assemblies, the TR7600LL SIII provides high-resolution 2D/2.5D/3D imaging and automated defect analysis for production environments.

Features

• Ultra-high-speed 3D CT X-ray inspection
• High-resolution imaging down to 7 μm
• True 3D solder joint viewer and planar CT option
• Extra-large board handling up to 1000 × 660 mm
• Capable of inspecting 01005 in components

Imaging System
Camera: Ultra-high-speed line-scan CCD cameras (3 or 5 units; 9 or 15 sensors)
X-ray source: 60 - 130 kV
Imaging resolution: 7 μm - 20 μm
Inspection methods: 2D, 2.5D, 3D slicing; Planar CT (optional)

Motion Table & Control
X-Axis Control: High-precision ballscrew + AC-servo controller
Y-Axis Control: High-precision ballscrew + AC-servo controller
Z-Axis Control: High-precision ballscrew + AC-servo controller
X-Y Axis Resolution: N/A

Board Handling
Max PCB size: 1000 × 660 mm
PCB thickness: 0.6 - 7 mm
Max PCB weight: 12 kg
Top clearance by resolution: 20 μm → 50 mm; 15 μm → 30 mm; 10 μm → 15 mm; 7 μm → 7 mm
Bottom clearance: 70 mm
Edge clearance: 3 mm or 5 mm
Conveyor height: 880 - 920 mm (optional 940 - 965 mm)
* SMEMA compatible

Inspection Functions

• Capabilities: Missing, Misalignment, Tombstone, Billboard, Tantalum polarity, Rotation, Floating
• Defects detected: Insufficient/excess solder, Bridging, Open, Solder ball, Non-wetting, Void, Lifted lead

Dimensions
WxDxH: 1750 × 2140 × 1945 mm
Weight: 4500 kg
Power requirement: 200 - 240 VAC three phase, 50/60 Hz, 7 kVA (optional transformer for 346 - 416 VAC)

Technical specifications

• Model: TR7600LL SIII (CT AXI)
• Camera: Ultra-high-speed line-scan CCD (3 or 5 units; 9 or 15 sensors)
• X-ray source range: 60 - 130 kV
• Imaging resolution: 7 μm - 20 μm
• Inspection methods: 2D, 2.5D, 3D slicing; Planar CT optional
• Max PCB size: 1000 × 660 mm
• PCB thickness range: 0.6 - 7 mm
• Max PCB weight: 12 kg
• Top clearance by resolution: 20 μm → 50 mm; 15 μm → 30 mm; 10 μm → 15 mm; 7 μm → 7 mm
• Bottom clearance: 70 mm
• Edge clearance: 3 mm or 5 mm
• Conveyor height: 880 - 920 mm (optional 940 - 965 mm)
• Capabilities: Missing, Misalignment, Tombstone, Billboard, Tantalum polarity, Rotation, Floating
• Detectable defects: Insufficient/excess solder, Bridging, Open, Solder ball, Non-wetting, Void, Lifted lead
• Machine dimensions (WxDxH): 1750 × 2140 × 1945 mm
• Machine weight: 4500 kg
• Power: 200 - 240 VAC three phase, 50/60 Hz, 7 kVA (optional transformer for 346 - 416 VAC)