Adhesive label

printabletamper-evidentself-adhesive

Summary
We supply adhesive labels designed for electronics manufacturing: they withstand SMT reflow processes up to +300 °C, resist isopropanol (IPA) and common cleaning solvents, comply with RoHS, and are suitable for ESD-controlled environments. They support DataMatrix codes readable by machine vision for PCB traceability. Available in very small formats with dimensional precision and stability for microcomponents and boards.

Main properties

• Temperature: Up to +300 °C (withstand SMT reflow peaks without deformation or adhesive migration).
• Regulation: RoHS compliant; materials and inks free of halogens and restricted substances.
• Chemical resistance: Resistant to IPA, acetone and ultrasonic cleaning; stable printing with resin ribbons.
• Traceability: Compatible with DataMatrix for machine-vision reading on PCBs and microcomponents.

Primary applications

• Labeling PCBs that undergo SMT reflow ovens (+300 °C).
• ESD labels for protected areas (EPA) and sensitive components.
• Traceability of boards and microcomponents using DataMatrix and machine vision.
• Miniature labels from 6×6 mm for SMD and THT parts.
• Asset and equipment marking with RoHS compliance.

Common materials and features

• Polyester: dimensional stability, good printability, durability; resistant to IPA, acetone and ultrasonic cleaning; finishes in white matte, silver and clear; RoHS compliant.
• High-temperature (ARGIPRINT° and polyimide): formulations to resist intense heat without deforming or off-gassing; ARGIPRINT° withstands peaks up to +300 °C; no adhesive migration; halogen-free; RoHS compliant.
• Dissipative polyester (ESD): variant with controlled surface resistivity; meets ANSI/ESD S20.20; printable with high-density DataMatrix; RoHS compliant.
• Security materials: destructible adhesives or void layers to provide tamper evidence for warranty-sensitive equipment or high-value assets.

Usage conditions in electronic processes

• SMT / reflow oven: the label must withstand the complete thermal profile (including peak and cooling) without melting, deforming or transferring adhesive onto components or traces.
• Chemical cleaning: label and print must not dissolve or smear with IPA, acetone or ultrasonic cleaning; the material+tint combination must be validated.
• ESD environments: labels must not generate or accumulate electrostatic charge; dissipative versions meet surface resistivity requirements for EPA areas.
• Small formats: miniature DataMatrix from 6×6 mm with sufficient contrast and density to remain readable after reflow and cleaning.

Regulation and traceability

• RoHS: materials, adhesives and inks free of halogenated and restricted substances (Pb, Hg, Cd, Cr VI, PBDE, PBB).
• ANSI/ESD S20.20: dissipative properties and controlled surface resistivity for use in ESD protected areas.
• PCB traceability: DataMatrix readable after reflow and cleaning; compliance with IPC/MES parameters for contrast and decodability.
• Thermal profile: validation with the customer's actual oven profile (SAC305, SnPb or others) is required to confirm compatibility.

Highlighted specific applications

• Reflow-oven labels for SMT: high-temperature ARGIPRINT° · up to +300 °C · no adhesive migration.
• ESD labels: dissipative, compliant with ANSI/ESD S20.20 and EPA processes.
• Traceability with miniature DataMatrix: from 6×6 mm, readable by machine vision after manufacturing processes.
• Solvent-resistant labels: polyester with resin ribbon to maintain adhesion and code legibility.

Features / technical specifications

• Maximum temperature: withstand reflow peaks up to +300 °C.
• Chemical resistance: resistant to IPA, acetone and ultrasonic cleaning (with appropriate material and ribbon).
• Regulation: RoHS compliant; declarations of conformity available for common materials.
• ESD: dissipative versions with controlled surface resistivity per ANSI/ESD S20.20.
• Traceability: DataMatrix readable by machine vision; formats from 6×6 mm.
• Key materials: ARGIPRINT°, polyester, polyimide; options with non‑migratory or destructible adhesives depending on application.
• Printing: resin ribbons recommended for solvent resistance and maintaining code contrast.