Data transmission wireless module SLM900

embedded

MeiG Smart SLM900 series smart module adopts SDM660 of Qualcomm Snapdragon 600 series chipset, equipped with 14nm FinFET process of CPU, built-in 64bit ARM, and 8-core Kryo (4*2.2GHz & 4*1.8GHz). It supports decode/encode up to 4K@30fps, H. 265 with Android 9.0 operating system. It integrates on-board memory of 32GB+3GB (options of 64GB+4GB, 128GB+8GB), carrier aggregation of LTE Cat.6 and 2*20MHz with a maximum downlink rate up to 300Mbps. It also supports multiple network standards such as LTE-TDD, LTE-FDD, WCDMA, EVDO, TD-SCDMA and CDMA, with embedded multi-constellation and high-sensitivity GNSS and 2.4 & 5G Wi-Fi. SLM900 series modules have different variants of SLM900-C, SLM900-E*, SLM900-A*, SLM900-LA*, SLM900-J*, SLM900-AU* and SNM900 for different market. SLM900 integrates abundant functional interfaces, including LCM, touch screen, camera, microphone, speaker, UART interface, USB interface,I2C interface, SPI interface, etc. It is suitable for a variety of M2M applications such as Smart POS, vending machine, Logistics Terminal, VR Camera, Intelligent Robot, Video Monitoring, Security Monitoring, Vehicle Equipment, Intelligent Information Acquisition Equipment, Intelligent Handheld Terminal, UAV and other products. Main Advantage： ● LTE Cat.6 and 2x20MHz carrier aggregation with maximum downlink rate up to 300 Mbps ● Overall coverage of various network systems ● Dual screen, different display and dual touch control with main screen support up to 2560*1600 ● @ 60fps, with a maximum support for auxiliary screen of 2560*1600@60fps ● dual camera, up to 4 cameras