Air cooler Hollowfin®

industrialfor electronics

The Fabfin heat sink stands out from ordinary extruded heat sinks because of its increased surface area, giving it excellent performance. Using a swaging process means a variety of its higher fins and increased height-to-space ratio types of fins can be used. The Hollowfin heat sink uses the same technology but the fins are doubled per fin slot to increase their density on the baseplate. • Multiple fins joined to baseplate by swaging process • Metal to metal construction. Al/Al Cu/Al Cu/Cu • No epoxy/glue used in fabrication process • Extremely robust fabrication • No thermal barrier at fin to baseplate joint • Fin height to spacing ratio much greater than extrusion • -40C to + 350C storage and operating range • Capable of withstanding various shock and vibrations