DIN rail network appliance POC-900

compactAMD Ryzen™Ethernet

Overview
The POC-900 Series is an ultra-compact, fanless DIN-rail embedded computer based on the AMD® Ryzen™ PRO 8640U platform. It preserves the compact DIN-rail footprint of previous POC families while delivering enhanced CPU/GPU/NPU performance and expanded connectivity for edge AI, industrial automation and machine vision applications.

Platform & performance
Powered by the AMD® Ryzen™ PRO 8640U (6C/12T) with integrated Radeon RDNA3 graphics and a 16 TOPs NPU (Ryzen™ AI), the system supports PCIe Gen4 NVMe M.2 storage and DDR5-5600 memory (up to 32 GB, ECC or non-ECC) for accelerated inferencing and real-time processing.

Connectivity & I/O
Onboard interfaces include 4x PoE+ GbE ports, 4x USB 3.2 Gen2 Type-A (screw-lock), 2x HDMI 2.0b, isolated 4-CH DI and 4-CH DO, serial ports with configurable RS-232/422/485 modes, MezIO® expansion and front-access I/O with DIN-rail mounting; optional fan variant available.

Key product features

• AMD® Ryzen™ PRO 8640U (15W–30W TDP, 6C/12T)
• Integrated NPU 16 TOPs (SoC up to 31 TOPs with Ryzen™ AI)
• Up to 32 GB DDR5-5600 via one SODIMM (ECC/non-ECC)
• 4x PoE+ GbE ports (IEEE 802.3at) and 4x USB 3.2 Gen2 Type-A (screw-lock)
• 2x HDMI 2.0b (3840×2160 @ 60Hz)
• M.2 2280 (PCIe Gen4 x4) NVMe support and full-size mini PCIe slot
• MezIO® expansion interface for application-specific I/Os
• DIN-rail mounting with optional wall-mount; fanless and fan variants

Specifications (summary)

• Processor: AMD® Ryzen™ PRO 8640U (6C/12T, 3.5/4.9 GHz, 15W–30W)
• Graphics: AMD® Radeon RDNA3
• Memory: Up to 32 GB DDR5-5600 (one SODIMM)
• Storage: 1x M.2 2280 M key (PCIe Gen4 x4) for NVMe SSD
• Ethernet: 4x GbE (Intel® I350-AM4) with WoL; PoE+ IEEE 802.3at on ports 1–4
• USB: 4x USB 3.2 Gen2 Type-A (10 Gbps) with screw-lock
• Video: 2x HDMI 2.0b (3840×2160 @ 60Hz)
• Serial: configurable RS-232/422/485 ports (COM1–COM4)
• Isolated DIO: 4 DI, 4 DO
• Audio: 1x 3.5 mm jack (mic-in & speaker-out)
• Expansion: 1x full-size mini PCIe (PCIe + USB2) with micro SIM; 1x MezIO® connector
• Power: 8–35V DC via 3-pin pluggable terminal block
• Dimensions & Weight: 64×116×176 mm (fanless) / 92×118×176 mm (with fan); 1.2 kg (fanless) / 1.4 kg (with fan)
• Operating Temp: -25°C to 70°C (depends on TDP and fan)
• Compliance: CE/FCC Class A; UL 62368-1; IEC 62368-1
• Release Date: 2026-01-02

Ordering & options
The POC-900 Series is available in fanless and fan-assisted variants with configurable SKUs. Optional accessories include AC/DC adapters, wall-mount kits, fan assembly and MezIO® modules to add application-specific I/Os.