CompactPCI backplane 23006-765

PICMG1-5 slots

The nVent SCHROFF CompactPCI Backplanes have best in class signal integrity and MTBF values due to SMD components, ceramics capacitors and press fit connectors. Features In accordance with: PICMG 2.0 R3.0 CompactPCI Core specification, PICMG 2.1 R2.0 Hot Swap specification, PICMG 2.9 R1.0 System Management Bus specification, PICMG 2.10 R1.0 Keying specification Digital GND can be connected to/isolated from chassis-GND by means of screws V(I/O) adjustable to +3.3 V or +5 V Infeed of supply voltages via powerbugs (ring tag M4), FASTONs Outer layers act as GND surfaces Utility plug for status signals (SMCQ) Multiple backplanes can be placed together without loss of slots Outstanding high-frequency noise suppression and very high MTBF values due to ceramic capacitors Intelligent platform management bus (IPMB) connector to PICMG 2.9