X-ray computed tomography machine VT-X700

high-speedautomated(CT)

Overview
Omron's automated inspection capability combines submicron X-ray CT imaging with quantitative metrology to ensure process quality and yield control in semiconductor mass-production environments.

Sub-title
High-speed automated X-ray CT inspection system for semiconductor mass production, offering recipe-based workflows and quantitative measurement.

Trends

• Downsizing of packages
• Increased density with stacked layers
• Integration of multiple devices (SiP)

Technology
Omron’s 3D CT platform delivers:

• Fast, quantitative metrology for process control
• Stable imaging with sub-micron magnification
• Recipe-based automated inspection for repeatable results

Automated Inspection and Metrology
Designed for inline automated inspection and metrology workflows to support high-volume semiconductor production and reduce manual handling.

Application
Targeted at semiconductor inspection and metrology in mass-production lines for package verification, defect detection and dimensional control.

Caractéristiques / spécifications techniques

• Product family / model: VT-X700 / VT-X900
• Technology: 3D X-ray CT (Submicron CT imaging)
• Primary capabilities: Automated inspection, quantitative metrology, recipe-based inspection
• Imaging: Sub-micron magnification
• Target market / application: Semiconductor mass-production inspection
• Key trends addressed: downsizing packages, higher density stacked layers, multi-device combinations (SiP)
• Last update on page: March 2, 2015