The LAPLACE-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules. The automatic machine punches and forms lead frames, dispenses solder paste and performs diode laser attach to the lead frame. A final electrical and visual test is done on the assembled modules and chip packages within the machine.
Highlights
• Reel-to-reel cutting system for metal lead frame
• Pick and place unit for punched metal parts and assembled parts
• High speed paste dispense
• Diode pick up from die feeder
• Laser soldering
• Electrical test
• Optical test
Benefits
• Automated Processes