Epoxy adhesive CHO-BOND® 584-29

for metaltwo-componentfor electronics

Short description
Parker Chomerics CHO-BOND® 584-29 is a two-component, silver-filled conductive epoxy adhesive formulated for thin bond lines and applications requiring precise dispense control.

Packaging / Available configurations

• 1 gram, 2 component, premeasured CHO-PAK
• 2.5 gram, 2 component, premeasured CHO-PAK
• 3 gram, 2 component, premeasured syringe kits (10 total)
• 10 gram, 2 component, premeasured CHO-PAK
• 4 fluid ounce, 2 component, polypropylene kit
• 8 fluid ounce, 2 component, polypropylene kit

Technical Specifications (table)
Weight: 1 g, 2.5 g, 10 x 3 g, 10 g, 85 g, 454 g
Primer Included: Not Required
Polymer Material Options: Epoxy
Filler Material: Silver
Ratio: 100:6.3
Color: Silver
Volume Resistivity: 0.002 Ω-cm
Lap Shear Strength: 8274 kPa
Specific Gravity: 2.5
Durometer: 80
Operating Temperature: -55 to 125 °C
Operating Time: 0.5 Hours
Shelf Life: 12 Months
Film Thickness: 0.03 mm

Full product description
Parker Chomerics CHO-BOND® 584-29 is supplied as a two-component, silver-filled epoxy designed for applications requiring thin bond lines and precise application control. It provides low volume resistivity and high lap shear strength suitable for conductive bonding in electronic, EMI shielding and grounding applications.

Features / Technical specifications

• Polymer: Epoxy
• Filler: Silver
• Volume resistivity: 0.002 Ω-cm
• Lap shear strength: 8274 kPa
• Specific gravity: 2.5
• Durometer: 80
• Operating temperature range: -55 to 125 °C
• Operating time (working time): 0.5 hours
• Shelf life: 12 months
• Film thickness (typical): 0.03 mm
• Available packagings: 1 g, 2.5 g, 3 g syringe kits, 10 g, 4 fl oz kit, 8 fl oz kit