Optical inspection machine Xceed BSI

3DPCBfor the electronics industry

Product overview
Xceed BSI is a 3D automatic optical inspection (AOI) solution dedicated to bottom-side inspection of PCBs and assemblies. It integrates laser line scan imaging and is designed to perform immediate inspections without a board flipping process. The system is presented alongside the reference PCI 100 for bottom-side verification.

Key features

• 3D AOI optimized for bottom-side inspection
• Laser line scan imaging method for precise height and shape capture
• High-throughput inspection (industry-leading speed)
• Immediate inspection workflow without flipping or additional handling
• Specialized detection for THD pins, wave and selective soldering zones, and SMD components
• Detects foreign material, contamination and PCB warpage without extra cycle time

Inspection items

• THD pins and through-hole components
• Wave soldering and selective soldering areas
• SMD components on bottom side
• Other bottom-side related defects and anomalies

Technical specifications

• 3D AOI capability focused on bottom-side geometries
• Laser line scan acquisition for high-resolution height mapping
• Engineered to eliminate board flipping and reduce handling
• High inspection throughput for inline production environments
• Targeted algorithms for THD, wave/selective soldering and SMD inspection
• Functions to detect foreign objects, contamination and PCB warpage within the same cycle