BGA rework station IR-D3 Discovery

The IR-D3 Discovery rework system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield SMD rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications. The IR-D3 can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers. Advanced Focused IR component heating 150W, lens based Focused IR heating with adjustable image system Quartz IR PCB preheating 2000W, two zone (240mm x 240mm heating area) Precision Component Pick and Placement Professional vacuum placement system Component Nest/Flux Application Facility Optional Jaw mounted nest with flux dip tray or component print frame Precision PCB Handling Professional PCB table with micro X/Y Component Temperature Sensing Standard non-contact IR temperature sensor PCB Temperature Sensing K-type wire thermocouple Optional non-contact IR temperature sensor Advanced Thermal Process Control Software based auto profile thermal control Camera/Prism Based BGA/CSP/QFN Alignment System (Optional) Auxiliary process observation camera Auxiliary Process Camera (Optional) Auxiliary process observation camera