Reflow soldering machine PE-W1600

automaticvacuumin-line

Product Introduction
Perfect Laser PE-W1600 nitrogen vacuum PCB reflow oven is a high-capacity automatic SMT reflow solution designed to perform lead-free reflow soldering in a controlled vacuum nitrogen environment. The vacuum process reduces voids and soldering defects, stabilizes yields and improves production efficiency for high-precision PCB assembly.

Product Features

• Integrated high-efficiency vacuum module with imported Busch 100B vacuum unit for stable vacuum performance.
• Directly settable test welding temperature curve mode for fast process tuning.
• Multi-zone temperature design with independent control to meet varied thermal profiles (Top 12 / Bottom 11).
• Void rate controlled below 3% in standard operation; can be optimized to below 1% under suitable process settings.
• Efficient vacuum pump unit enables rapid pressure reduction (vacuum degree 1–10 mbar, typical operation as low as ~2 mbar).
• Three-stage transport system: heating zone, vacuum zone and cooling zone, each adjustable.
• Average cycle time 40–60 seconds for high throughput SMT lines.
• Effective flux recovery and rosin residue control system.
• Vacuum measured inside the reaction chamber for representative process control.
• Automatic furnace lid opening for easier cleaning and maintenance.
• Equipped with 5 HP water chiller for reliable cooling capacity required by lead-free processes.
• Low maintenance design to reduce downtime.

Applications
Used for high-precision PCB assembly in electronics manufacturing, optical equipment, aerospace components and medical device production lines where void reduction and consistent solder quality are required.

Technical Data
Model: PE-W1600
External dimensions: 7160 × 1670 × 1460 mm
Main color: Computer Grey
Net weight: ≈ 4500 kg
Heating zones: Top 12 / Bottom 11
Heating zone length: 3850 mm
Cooling zones: Top 2 / Bottom 2 (cold air recirculation)
Exhaust air volume: 10 m3/min × 2 channels
PCB max width: 460 mm
Transport direction: Left → Right
Component height: 40 mm on board / 30 mm below board
Transport belt speed: 300–2000 mm/min
Transport belt height: 900 ± 20 mm
PCB transport method: Chain
Vacuum degree: 1–10 mbar (process control; can reach ~2 mbar)
Power supply: 5-wire 3-phase, 380V 50/60Hz
Starting power: 70 kW; Working power: 16 kW
Heating time (approx.): 45 minutes
Temperature range: heating zone up to 300 °C; vacuum zone up to 260 °C
Temperature control: PID full closed-loop control, SSR drive
Heating method: hot air convection
Temperature accuracy: ±1 °C
Cooling: water cooling with 5 HP external chiller
Alarms: sound and light for abnormal temperature; signal lighthouse indicators
Parameter storage: multiple production profiles storable
Lubrication: automatic/manual selectable

Packaging & Delivery
Packaged for sea or air shipment with professional protective packing; lead times and logistics coordinated per order; standard export documentation available.

Competitive Advantages

• Vacuum nitrogen process reduces voids and rework rates.
• Designed for high-throughput SMT lines with precise temperature control.
• Imported vacuum module and robust cooling for lead-free processes.
• Multiple stored profiles and easy process tuning reduce setup time.

Specifications

• Product name: Lead Free Nitrogen Vacuum Reflow Oven Soldering Machine
• Model: PE-W1600
• External dimensions: 7160 × 1670 × 1460 mm
• Net weight: ≈ 4500 kg
• Heating zones: Top 12 / Bottom 11
• Heating zone length: 3850 mm
• Cooling zones: Top 2 / Bottom 2
• Exhaust air volume: 10 m3/min × 2
• PCB max width: 460 mm
• Transport direction: Left → Right
• Component height: 40 mm on board / 30 mm below board
• Belt speed: 300–2000 mm/min
• Vacuum degree: 1–10 mbar (typical ~2 mbar)
• Power supply: 380V 50/60Hz 3-phase
• Starting/working power: 70 kW / 16 kW
• Temperature control: PID closed-loop, SSR; accuracy ±1 °C
• Cooling: Water cooling, 5 HP chiller