PERMABOND® ES558 is a single-part epoxy paste which flows like solder when heated during curing.
The adhesive is toughened for maximum impact resistance, along with excellent peel and shear
strength. ES558 is ideal for bonding a wide range of materials including metals, ferrites, ceramics and composites.
Surface Preparation
Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces.
Some metals such as aluminium, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.
Directions for Use
1) The adhesive should be dispensed from the cartridge via the nozzle supplied (this can be cut to give the appropriate sized bead to cover the bond area).
2) Apply the adhesive to one surface and avoid entrapping air.
3) Assemble parts applying sufficient pressure to ensure the adhesive spreads to cover the entire bond area.
4) Use a jig / clamp to prevent parts moving during cure.
5) It is advisable not to disturb the joint until the adhesive is fully cured.
6) Cure with heat – see page one for cure schedule.
Additional Information
This product is not recommended for use in contact with strong oxidizing materials.
Information regarding the safe handling of this material may be obtained from the safety data sheet (SDS).
Users are reminded that all materials, whether innocuous or not, should be handled in accordance with the principles of good industrial hygiene.