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Epoxy adhesive ES558
for ceramicsfor composite materialsfor metal

Epoxy adhesive - ES558 - Permabond - for ceramics / for composite materials / for metal
Epoxy adhesive - ES558 - Permabond - for ceramics / for composite materials / for metal
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for ceramics, for composite materials
Number of components
single-component
Applications
industrial, for bonding
Technical characteristics
heat-curing, chemical-resistant
Working temperature

120 °C
(248 °F)

Description

Extremely high shear & peel strength
Excellent heat, environmental and chemical resistance.
Flows during cure to seal gaps
IDEAL FOR: Applications requiring penetration into small gaps

PERMABOND® ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength. ES558 is ideal for bonding a wide range of materials including metals, ferrites, ceramics and composites.



Catalogs

Exhibitions

Meet this supplier at the following exhibition(s):

Advanced Engineering
Advanced Engineering

4-05 Nov 2026 Birmingham (United Kingdom) Stand S120

  • More information
    Southern Manufacturing 2027
    Southern Manufacturing 2027

    2-04 Feb 2027 Farnborough (United Kingdom) Stand A165

  • More information
    See all exhibitions

    Other Permabond products

    Epoxies - 1 Part (ES)

    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.