Sputtering coating machine S-MPuls

high-performancemulti-layer

S-MPuls for coin punches For coin punches, PLATIT has developed a Custom Coating Solution for high-quality coatings with a good amorphous structure as well as high density, surface quality and reproduction accuracy. Technologies applied: 1 x DC-pulsed magnetron SPUTTER cathode with a rotating magnetic field SPUTTER source arranged at the bottom of the chamber Etching technologies applied: LGD® Plasma etching with argon, glow discharge, with auxiliary anode Load and cycle times: 4 -6 batches/day with a batch time of 3.5 h Coating volume with defined coating thickness: ø 70 - 250 [mm] Substrate holder: ø 300 mm, varying customer-specific versions possible Load up to 20 kg Software: Simple use and maintenance PLATIT’s SmartSoftware (PC and PLC system) Modern control system with touch screen Data recording and real-time display of process parameters and flow Manual and automatic process control Remote diagnostics and maintenance Machine dimensions: Door opening: B 450 x H 615 [mm] Footprint (coating unit with electrical cabinet): W 945 x D 1403 x H 2068 + W 608 x D 1369 x H 2068 [mm]