Measurement scanner FSS 310

inspectionopticalhigh-speed

The Flying Spot Scanner (FSS) 310 uniquely combines OCT with wide field-of-view scanning, and solves the problem that ultra-precise measuring systems are normally very slow and extremely expensive. The FSS 310 has a flexible, fast-moving measurement point within the field of view which enables a ROI inspection in ultra-short cycle times – without compromising accuracy. This device measures the total thickness variation (TTV), bow, warp and voids of an entire 12-inch wafer in a single scan. Advantages • High-speed, non-contact ROI inspection With a huge scan area of 310 mm, the FSS 310 checks a 12-inch wafer for TTV, bow, warp and voids in standard applications in less than 10 seconds, which enables a throughput of over 300 wafers per hour (including handling time). Thanks to the in-built scanning system, long paths of linear axes are replaced by short rotary movements, which significantly reduces measuring times and does away with the need for a precision axis. • Ease of use The FSS 310 and the optical sensor CHRocodile 2 IT form a standalone package that is easily integratable in in- and offline systems. Only a single connection to the CHRocodile 2 IT controller is needed to carry out a customized scan procedure with the FSS 310. Multiple software interfaces and tools enable you to easily set up your application. The list of defined measurement tasks is then stored on the optical sensor, which also controls the probe before a software visualizes the results.