Product DescriptionThis diamond wire saw is designed for slicing sapphire rods and wafers, with front feeding/unloading and wiring on both sides. The machine overall width is ≤ 2 m to maximize workshop utilization. A servo motor drives the tension swing-rod to ensure sensitive tension adjustment. Key structural components are adjustable to meet cutting requirements up to 50 N cutting tension, 2400 m/min wire speed and 700 mm rod length.
Key Features- Front feeding and unloading; wiring on both sides (one-way or two-way incoming)
- Overall width ≤ 2 m to optimize floor space
- Servo-driven tension swing-rod for precise tension control
- Designed to support up to 50 N cutting tension, 2400 m/min wire speed and 700 mm rod length
Product Parameters- Model: GC-SADW6670
- Application: Sapphire slicing/cutting
- Feeding/Unloading: Front
- Wiring: Both sides (one-way or two-way incoming)
- Max workpiece size: 4–6” × L700
- Max wire speed: 2400 m/min
- Wire diameter (steel): 0.23 mm
- Cutting tension: 10–50 N (designed up to 50 N)
- Cutting method: Downward cutting
- Fast forward/rewind: 50–500 m/min
- Max swing angle: ±12°; Max swing speed: 12°/s
- Wheelbase: 395 mm
- Main roller groove outer diameter: Φ192–Φ202 mm
- Max wire reserve: 65 km (with 0.2 mm wire)
- Supported rod length (design): 700 mm
- Approx. dimensions (L×W×H): 4300 × 2000 × 3100 mm
- Approx. equipment weight: 12000 kg
- Main roller weight: ≈140 kg per piece (net)