Electric chamfering machine GC-LD804

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Product Introduction
The GC-LD804 is a chamfering machine designed for edge chamfering of sapphire wafers. It is compatible with 4-inch, 6-inch and 8-inch wafers, supports processing of the OF reference surface and offers an optional NOTCH groove processing function. The machine features a dual-workstation layout, non-contact or contact wafer thickness measurement, rotation cleaning and centrifugal drying for stable, high-precision operation.

Product Parameters
Host size and weight: 2,250 (L)*1,650 (W)*2,600 (H) mm; 3,000 kg
Wafer size: 4/6/8 in
Wafer thickness: 300 μm~1,500 μm
Workstation: Dual workstation
Wafer reference surface shape: OF/Notch (Notch optional)
Equipment size: 2,250 (W)*1,650 (D)*2,600 (H) mm
Grinding X/Y/Z axis accuracy: ±1 μm
Ceramic suction cup plane accuracy: ≤3 μm
Spindle end face and radial accuracy (grinding bench & wheel): ±1 μm
Grinding wheel outer diameter: Φ202 mm
Grinding wheel mounting inner diameter: Φ30 mm
Grinding wheel thickness: 20 mm
Grinding wheel rotation speed: 0-4,000 r/min (according to customer's demands)
Notch grinding wheel rotation speed: 0-100,000 r/min (according to customer's demands)
Grinding wheel modes: T, R, TT, RR, TR types
Wafer thickness measurement (non-contact or contact): repeated measurement accuracy: ±2 μm; measurement point: center
Cleaning method: Rotation cleaning
Drying method: Centrifugal drying
Loading/unloading: Number of boxes: 4; Number of slots: 25 (adjustable)

Features / Technical specifications

• Suitable for edge chamfering of sapphire wafers; compatible with 4", 6" and 8" wafers
• Supports OF reference surface processing; optional Notch groove processing
• Dual-workstation design to increase throughput
• Wafer thickness range: 300 μm–1,500 μm; repeated measurement accuracy ±2 μm (center point)
• X/Y/Z axis positioning accuracy ±1 μm; ceramic suction cup plane accuracy ≤3 μm; spindle end face and radial accuracy ±1 μm
• Grinding wheel outer diameter Φ202 mm, mounting inner diameter Φ30 mm, thickness 20 mm; supports multiple wheel profiles (T, R, TT, RR, TR)
• Grinding wheel and Notch wheel speeds configurable to customer requirements (grinding wheel 0–4,000 r/min; Notch wheel 0–100,000 r/min)
• Rotation cleaning and centrifugal drying for wafer handling
• Loading/unloading: 4 boxes; up to 25 slots (adjustable)