- Robotics - Automation - Industrial IT
- Automation
- Process automation system
- RoboTechnik Intelligent Technology Co., Ltd.
Process automation system WEA100000L/ul
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Characteristics
- Options
- process
Description
Process :
● Adapt to M2 (156.75), M4 (161.75), G1 (158.75), M6 (166), M10 (182), M12 (210) and 230mm silicon wafers
● Compatible to different brands of wafer texuring and PSG removal equipment
Features :
● Input: Cassette or Stack
● Output: kinds of cassette
● Optional high-precision etching amount weighing debris detection, lamination detection, flip
● Optional match 5,6,8, 10 lanes
● Optional support MES interface and remote debug function OEE statistics & Energy consumption analysis
● Optional smart IGV interface
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.