Process automation system HIT

process automation system
process automation system
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process

Description

Process : ● Adapt to M2 (156.75), M4 (161.75), G1 (158.75), M6 (166), M10 (182), M12 (210) and 230mm silicon wafers ● Compatible to different sizes of tube PECVD equipment and plate PECVD equipment Suitable for HJT process Features : ● Loading and unloading: Cassette ● Output: graphite carrier box ● Optional PL test ● Clean room class 1000 ● Carrier board automatic cleaning function ● Optional support MES function and remote diagnosis function ● Optional smart IGV interface ● Intelligent machine, OEE statistics and energy consumption analysis function

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