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RF connector Q2™ series mezzanineboard-to-boardSMT
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Characteristics
- Type
- RF
- Format
- mezzanine, board-to-board, SMT
- Shape
- rectangular
- Other characteristics
- rugged, high-speed
- Pitch
0.635 mm
(0.025 in)- Data rate
17 GB/s
Description
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
FEATURES
Performance: Up to 8.5 GHz / 17 Gbps
Increased insertion depth
Dual stage hot pluggable
Integral ground/power plane
Shielded option available
Power and RF ends options
Contacts: Up to 208 I/Os
Stack height: 10.00 mm - 16.00 mm
Catalogs
No catalogs are available for this product.
See all of SAMTEC‘s catalogsExhibitions
Meet this supplier at the following exhibition(s):
Other SAMTEC products
High Speed Board-To-Board
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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