Climate chamber
temperaturefor rapid temperature cyclingfor electronic circuit boards

Climate chamber - Sanwood Technology - temperature / for rapid temperature cycling / for electronic circuit boards
Climate chamber - Sanwood Technology - temperature / for rapid temperature cycling / for electronic circuit boards
Climate chamber - Sanwood Technology - temperature / for rapid temperature cycling / for electronic circuit boards - image - 2
Climate chamber - Sanwood Technology - temperature / for rapid temperature cycling / for electronic circuit boards - image - 3
Climate chamber - Sanwood Technology - temperature / for rapid temperature cycling / for electronic circuit boards - image - 4
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Characteristics

Type
climatic
Controlled parameter
temperature
Test type
for rapid temperature cycling
Product applications
for electronic circuit boards, for semiconductors, for sensors
Application domain
for quality control, laboratory
Configuration
floor-standing, compact
Chamber material
anodized aluminum
Options and accessories
with temperature and climatic control, touchscreen-controlled, PLC-controlled, with swiveling tube
Other characteristics
ultra-low-temperature, for high temperatures, automatic, energy-saving, accelerated, thermal
Temperature

Min.: -80 °C
(-112 °F)

Max.: 225 °C
(437 °F)

Power

Min.: 220 W

Max.: 223 W

External length

Min.: 789 mm
(31.1 in)

Max.: 1,930 mm
(76 in)

External height

Min.: 1,543 mm
(60.75 in)

Max.: 2,163 mm
(85.16 in)

External depth

911 mm
(35.87 in)

Description

SANWOOD Temperature Forcing System for Semiconductor and Electronic Component Testing

Product Overview

The SANWOOD SMS-810-10S Temperature Forcing System delivers localized hot and cold air for semiconductor characterization, component evaluation and temperature-dependent failure analysis. Engineers can investigate performance changes while samples remain connected to electrical or optical measurement instruments.

Localized Thermal Conditioning

Apply temperature-controlled airflow to a selected component or board area to examine operating margins, compare measurements and reproduce intermittent faults.

Air Temperature and Sample Feedback Control

Select Air Mode or DUT Mode according to the required temperature reference. External Type-T and Type-K thermocouples provide feedback from a defined sample location.

Positioning and Laboratory Integration

Motorized vertical adjustment and pneumatic thermal-head actuation support fixture positioning. LAN and CAN interfaces enable monitoring from a host computer.

Cooling Without External Liquid Cryogens

Operation requires no external liquid nitrogen or liquid carbon dioxide supply.

Main Technical Specifications

Model: SMS-810-10S

Temperature Range: −80°C to +225°C

Typical Air Temperature Transition, Heating: Approximately 10 seconds from −55°C to +125°C

Typical Air Temperature Transition, Cooling: Approximately 10 seconds from +125°C to −55°C

System Airflow Output: 4–18 scfm, equivalent to 1.89–8.50 L/s

Temperature Control Modes: Air Mode and DUT Mode

External Temperature Inputs: Type-T and Type-K thermocouples

Thermal-Head Positioning: Motorized vertical lift and pneumatic actuation

Communication Interfaces: LAN and CAN for host-PC monitoring

Power Supply: 220–230 VAC, 50/60 Hz


Typical Testing Applications

Applications include digital and analog IC characterization, RF and mixed-signal evaluation, optical transceiver testing, power semiconductor testing, sensor evaluation and component-level failure analysis.

Relevant International Test Standards

For qualification projects, review the specified test method when selecting the equipment, fixture and temperature monitoring arrangement.

JEDEC JESD22-A104 — Temperature Cycling

Semiconductor reliability evaluation through repeated exposure to specified high and low temperature conditions.

MIL-STD-883-1, Method 1010 — Temperature Cycling

Evaluation of microcircuit resistance to temperature extremes and the effects of alternating exposure.

IEC 60068-2-1:2025 — Cold

Low-temperature testing of components and equipment under specified operating, transportation or storage conditions.

IEC 60068-2-2:2025 — Dry Heat

High-temperature testing of components and equipment, including energized and non-energized specimens.

IEC 60068-2-14:2023 — Change of Temperature

Evaluation of specimen response to specified changes in ambient temperature.

Test Method and Configuration Review

These references guide application review; suitability must be confirmed for the selected test condition and equipment arrangement. Evaluate exposure coverage, specimen temperature tolerances, transition requirements, dwell periods and cycle count before qualification testing.

The approximately 10-second specification describes the delivered air’s temperature transition. Actual sample stabilization depends on thermal mass, operating heat load, airflow and fixture conditions. Validate the measured specimen temperature profile under representative loading against the prescribed test requirements.

About SANWOOD

Founded in 1995, SANWOOD manufactures environmental and reliability testing equipment for semiconductor, electronics, automotive and aerospace applications. Its manufacturing facility exceeds 30,000 m², with products and services covering more than 100 countries and regions.

The product portfolio includes temperature forcing systems, HAST chambers, HALT/HASS chambers, thermal shock chambers and other environmental testing equipment for product development and reliability evaluation.

Request a Technical Proposal

Share your sample dimensions, target temperatures, operating heat load, fixture layout and communication requirements with SANWOOD. Include the applicable test standard and test condition where relevant.

A sample photograph or fixture drawing can help clarify positioning and measurement access. Contact SANWOOD for technical selection support and an application-based quotation.

Catalogs

No catalogs are available for this product.

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Exhibitions

Meet this supplier at the following exhibition(s):

ELECTRONICA 2026
ELECTRONICA 2026

10-13 Nov 2026 Munich (Germany) Hall C2 - Stand 130

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