Sample analysis system SawPolish Unit

motionautomatic

Overview The SawPolish Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Three models for sawing and polishing a wide range of crimp connections Polishing disc is in line with the saw blade for fast and simple processing Compatible with ElectrolyteStaining Unit and MacroZoom Unit 1.3 for a complete crimp cross section analysis Numerous sample holders are available for a variety of applications such as welding, potting and connector inspection The SawPolish Unit enables users to saw and polish samples quickly and cleanly using the combined sawing-polishing process. The SawPolish Unit can process crimp contacts for cross sections up to 60 mm² (1/0 AWG) or a maximum sample height up to 20 mm (0.79”). The saw blades will cleanly cut most common materials such as copper, aluminum, steel, alloy steel, stainless steel, titanium, bronze, brass, cast iron, gold, silver, inconel, nimonic, hastelloy, magnesium alloys and plastic. Other materials may be possible and can be evaluated during sample processing. The sample is placed in an interchangeable sample holder and inserted into the sample slide. The cutting blade and polishing disc are aligned so that the sample can be cut and polished in one motion to minimize processing time. Cutting blades are available in various widths to accommodate a range of sample sizes. Similarly, numerous sample holders are available for a variety of applications, such as welding, potting and connector inspection.