Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)
Graphics
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Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to four independent displays at up to 4K60
HDR resolution or one display at 8K resolution
Audio
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Lineout + MicIn combo TRRS Audio Jack
Other Interfaces
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Optional 2x 12 poles terminal block connectors with the
following I/O:
8x GPIOs
1x I2C
1x SPI
1x 5V
1x 3.3V
1x 12V
3x GND
Power ON Button
Optional TPM 1.2/2.0 module on-board
Power Supply
12VDC to 24VDC range, Mega-Fit 2p RA Connector
Coin cell battery for RTC On-Board
Operating Temperature
Commercial range: 0 °C ÷ +50 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W)
Industrial range: -40 °C ÷ +60 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W)
Dimensions
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199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)