Product Overview10.1-inch HMI based on Qualcomm® Dragonwing QCS6490, designed for industrial HMI and edge applications with high-performance CPU and NPU Acceleration for AI at the Edge.
Highlights- CPU: Qualcomm® Dragonwing QCS6490 (1x Cortex‑A78 @2.7 GHz, 3x Cortex‑A78 @2.4 GHz, 4x Cortex‑A55 @1.8 GHz)
- NPU: Qualcomm® AI Engine, up to 12 TOPS computing power.
- Graphics: Qualcomm® Adreno™ 643L
- Memory: Soldered LPDDR5‑6400, up to 12 GB (32‑bit, 2 channels) with IBECC
- Connectivity: Gigabit Ethernet, RS‑232, RS‑485, CAN, USB, Digital I/O; optional Wi‑Fi + BT 5.0
Display & Touch- Display: 10.1-inch, 1280×800
- Brightness: 400 cd/m²; LED lifetime: 50,000 hours
- Touch: P‑Cap projected capacitive touchscreen with 3.0 mm chemically strengthened cover glass
Storage & Mass Storage- eMMC 5.1 soldered on‑board up to 64 GB (boot device)
- SD: 4‑bit interface (boot device)
I/O & Interfaces- USB: 1x USB‑C Dual Role, 1x USB 3.0 Type‑A
- Serial: 2x RS‑232, 1x RS‑485
- Other: 1x I2C, SPI, 2x Digital In, 2x Digital Out
- Networking: 1x Gigabit Ethernet (optional Wi‑Fi + BT5.0)
Power & Environmental- Power supply: +9 VDC to +32 VDC
- Operating temperature: 0°C to +60°C
Software & Security- Operating System: Clea OS (Yocto)
- Security: Built‑in Secure Boot, OTA update support, device monitoring and secure OS integration
Mechanical- Dimensions: 270 x 187 x 52 mm
Applications & Ecosystem- Designed for industrial HMI, monitoring, safety and edge AI use cases
- Compatible with SECO Application Hub apps and containerized deployments (Docker)