Audio circuit board ReSpeaker Lite 2-Mic

Overview
The ReSpeaker Lite 2-Mic Array Voice Kit is an open-source voice assistant development kit based on the XMOS XU316 audio chipset and a pre-soldered XIAO ESP32S3 module. It combines a dual digital microphone array with on-board voice processing for far-field speech capture, noise suppression and local audio algorithms. The kit supports integration with Home Assistant via ESPHome for smart voice and home automation applications.

Key Features

• Pre-soldered ESP32 controller: XIAO ESP32S3 mounted via I2S pins for solder-free development.
• Dual microphone array: two digital microphones for far-field voice capture up to 3 m.
• On-board audio algorithms: XMOS XU316 provides NLU and audio processing including interference cancellation, acoustic echo cancellation, noise suppression and AGC.
• Open-source compatible: supports Arduino, PlatformIO, MicroPython and CircuitPython.
• Voice assistant integration: compatible with Home Assistant via ESPHome; supports integrations with Amazon Alexa and Google Assistant.
• RGB LED feedback: programmable WS2812 RGB LED for status indication.

Hardware Overview
The board includes dual microphones, power indicators, RGB lighting, mute function, user buttons, USB Type-C power, speaker connector and 3.5 mm headphone jack. Architecture pairs the XMOS XU316 audio core with a XIAO ESP32S3 module for wireless connectivity and control.

Applications
Suitable for smart speakers and virtual assistants, audio processing prototyping, conference systems, voice-controlled devices, keyword spotting and wake-word detection.

Specifications

• Core chip: XMOS XU316
• Digital microphones: 2 high-performance digital microphones
• Sensitivity: -26 dBFS
• Acoustic Overload Point: 120 dBL
• SNR: 64 dBA
• Power supply: USB 5V or external 5V
• Dimensions (array): 35 × 86 mm
• Audio output: speaker connector / 3.5 mm headphone jack
• Maximum sampling rate: 16 kHz
• Speaker support: supports 5W amplifier speakers
• XIAO ESP32S3 processor: ESP32-S3R8 (Xtensa LX7 dual-core, up to 240 MHz)
• Wireless: 2.4 GHz Wi‑Fi; BLE: Bluetooth 5.0, Bluetooth Mesh
• On-chip memory (XIAO): 8M PSRAM & 8MB Flash
• Interfaces (XIAO): 1× UART, 1× IIC, 1× IIS, 1× SPI, 11× GPIO (PWM), 9× ADC, user LED, charge LED, reset and boot buttons
• XIAO dimensions: 21 × 17.5 mm
• Power (XIAO): Type‑C input 5V; BAT input 4.2V; circuit operating voltages: Type‑C: 5V @ 19 mA; BAT: 3.8V @ 22 mA; charging current: 100 mA
• Low power consumption (supply 3.8V): modem-sleep ~25 mA; light-sleep ~2 mA; deep sleep ~14 µA
• Wi‑Fi enabled power consumption (active): ~100 mA
• BLE enabled power consumption (active): ~85 mA
• Operating temperature: -40°C to 65°C