PVD deposition machine DPC-RTAS1215+

sputteringthin-filmvacuum

Higher Efficient Process: 1. Double sided coating is available by turnover fixture design 2. Up to 8 standard planar cathode flanges for multiple sources 3. Large capacity up to 2.2 ㎡ ceramic chips per cycle 4. Fully Automation, PLC+Touch Screen, ONE-touch control system Lower Production Cost: 1. Equipped with 2 magnetic suspension molecular pumps, fast starting time, free maintenance; 2. Maximum heating power; 3. Octagonal shape of chamber for optimum space using, up to 8 arc sources and 4 sputtering cathodes for fast deposition of coatings The DPC process- Direct Plating Copper is an advanced coating technology applied with LED and semiconductors in electronic industries. One typical application is Ceramic Radiating Substrate. Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditional manufacturing methods: DBC LTCC HTCC have much lower production costs. Royal Technology’s team collaborated with our customer to develop the DPC process successfully applying PVD sputtering technology.