PVD deposition machine RTEP1616-SP

sputteringthermal evaporationthin-film

RTEP1616-SP Vacuum Metalizing Machine is specially designed for EMI shielding thin film and NCVM fillm deposition, which widely used in telecommunication devices, computers, notebooks, consumer electronics, home appliance, aerospace and military items. Our customers are: Sumgsung, Apple, Lenovo, Huawei electronics manufactures. The chamber size diameter 1600mm and height 1600mm can accommodate a variety of products. EMI Shielding Film Properties 1) Film thickness : 1.5 ~ 3 microns depends on the requirement. 2) Film resistance: (ohm) better than 0.5Ω 3) Adhesion: 3M810 tape > 5B EMI shielding film coating process 4) DC Sputtering Stainless Steel 5) Copper deposition by Thermal Evaporation 6) DC Sputtering Stainless Steel, full cover on Cu film layer. Electro Magnetic Interference Shielding Metalizer Features 1) 2-door structure and fast pumping speed for a high productivity 2) Operating friendly touch screen panel with PLC control 3)Humanity friendly software program design for stable production and high quality. 4) High sputtering target utilization rate ensure a low production cost. 5) Good uniformity & Excellent adhesion 6) Advanced design concept for a better performance to enhance production efficiency and qualified rate. 7) Ion source device for plasma cleaning and surface activity treatment to improve adhesion.