PVD deposition machine RT-DPC1215+

sputteringion beam-assistedthin-film

The DPC-RTAS1215+ Sputtering system is the upgraded version of the original ASC1215 model, the newest system has several advantages: Higher Efficient Process: 1. Double sided coating is available by turnover fixture design 2. Up to 8 standard planar cathode flanges for multiple sources 3. Large capacity up to 2.2 ㎡ ceramic chips per cycle 4. Fully automated, PLC+Touch Screen, ONE-touch control system Lower Production Cost: 1. Equipped with 2 magnetic suspension molecular pumps, fast starting time, free maintenance; 2. Maximum heating power; 3. Octagonal shape of chamber for optimum space using, up to 8 arc sources and 4 sputtering cathodes for fast deposition of coatings The DPC process- Direct Plating Copper is an advanced coating technology applied with LED and semiconductors in electronic industry. One typical application is Ceramic Radiating Substrate. Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditional manufacturing methods:  DBC  LTCC  HTCC have much lower production costs.  Royal Technology’s team collaborated with our customer to develop the DPC process successfully applying PVD sputtering technology.    Applications of DPC: HBLED Substrates for solar concentrator cells Power semiconductor packaging including automotive motor control Hybrid and electric automobile power management electronics Packages for RF Microwave devices