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Alkaline texturing machine for wafers
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Characteristics
- Type
- alkaline
- Applications
- for wafers
Description
·Throughput: 600pcs/batch,14400pcs/h(210mm wafer)；720pcs/batch,17280pcs/h(182mm wafer);
·Compatible with rear side etch polishing and mono-crystalline rear side texturing process;
·Suitable for various additives;
·Wafer thickness down to 120μm;
·With dry clean area and self-cleaning system;
·Quick inline bath change;
·Suitable with MES,RFID system, inline weight testing optional.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.