High temperature thermal shock chamber TS series

low-temperaturerapidfor rapid temperature cycling

Overview
The TS Series JEDEC22-A104 thermal cycling and thermal shock chamber combines thermal cycling, rapid temperature change and thermal shock capabilities in a single platform for reliability testing of semiconductors, ICs, PCBs and electronic assemblies. The system supports humidity control during high-temperature or linear temperature-change profiles and offers modular configurations to match production or laboratory workflows.

Key Functions

• Integrated thermal cycling, rapid temperature change and thermal shock testing
• Optional humidity control during high-temperature or linear-change tests
• Three low-temperature grades (Type A/B/C) with optional high-temperature up to +200 °C
• Touch-screen control and RS-232 / RS-485 communication for data logging and automation

Configurations

• Two-chamber — Basket transfer (vertical stack): sample basket moves between hot and cold chambers for fast transfer and high throughput; suited to batch cycling and production screening
• Single-chamber — Static sample (airflow switching): high-speed hot/cold airflow switching while sample remains stationary; suited to delicate or wired DUTs to avoid mechanical stress

What This System Delivers (Features)

• Speed: recovery ≤ 5 min, conversion ≤ 5 s to meet IEC/EN test profiles
• Coverage: temperature grades down to −65 °C; optional +200 °C high-temperature capability
• Cycling: programmable up to 999 cycles and up to 999 hours per step
• Control: graph-based touch-screen interface; RS-232 / RS-485 for logging and automation
• Cooling: binary/semi-hermetic double-stage cooling with water-cooled or air-cooled compressor options
• Operation modes: automatic and manual shock modes

Standards Compliance

• EN 60068-2-14 / IEC 60068-2-14 (Change of Temperature)
• GB/T 2423.22
• MIL-STD-810G / MIL-STD-810F
• ISO 16750-4
• JESD22-A104 (Temperature Cycling) and JESD22-A106 (Thermal Shock)

Deliverables & Service

• Installation and operation manual with wiring diagrams and setup checklist
• Export packing list and standard shipping documentation
• 12-month warranty covering chamber, refrigeration system and controller; lifetime remote technical support
• Standard lead time: ~20 working days; customized builds: 30–40 working days

TS Series — Five model comparison

• TS-49 (internal 400×350×350 mm) — approx. 450 kg
• TS-80 (internal 500×400×400 mm) — approx. 600 kg
• TS-150 (internal 600×500×500 mm) — approx. 750 kg
• TS-252 (internal 700×600×600 mm) — approx. 950 kg
• TS-450 (internal 800×750×750 mm) — approx. 1200 kg

Applications

• Reliability testing of semiconductor devices and ICs
• PCB and electronic assembly validation
• Automotive electronic component qualification
• Aerospace component and material testing
• Materials testing for metals, plastics, rubber and composites
• Research laboratories and certification bodies

Technical specifications

• Temperature grades: Type A −40 °C; Type B −55 °C; Type C −65 °C; high temp +150 °C standard, +200 °C optional
• Recovery time: ≤ 5 minutes; conversion time: ≤ 5 seconds
• Control accuracy / uniformity: ±0.5 °C / ±2 °C
• Inner material: SUS 304 stainless steel; outer: stainless or painted cold-rolled steel
• Insulation: high-density, high-temperature resistant foam
• Control system: PID + SSR + microcomputer balanced control; touch-screen; RS-232/RS-485
• Cooling: semi-hermetic or hermetic double-stage compressors (water-cooled or air-cooled)
• Safety: circuit breaker, high/low pressure switches, failure alarm, over-temperature and water shortage protection
• Power options: AC 220 V single-phase or AC 380 V three-phase
• Warranty: 12 months; lifetime remote technical support