Thermally conductive gap filler
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Description
The phase change materials " PCM" are used to minimize the thermal resistance between the component and a radiator (total wet-out). Easy to apply at room temperature, it will soften when the component temperature will be between 50 ° C and 65 ° C and perfectly matches the empty space.
Applications :
- Telecommunications
- Power semiconductors
- Wireless communications hardware
- Power conversion
- Graphic cards
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