3-axis positioning system 782459:003.26

automaticfor wafer inspection and metrologyfor the semiconductor industry

MP700-3 Flat 3D Aligner Customizable: • Ideal for high-precision alignment of large substrates, masks, frames • Suitable for large samples with an aperture of 730 x 730 mm • High repeatability up to 0.4 µm / ± 0.0002° for loads up to 28 kg • Ultra flat design of 990 x 1090 x 225 mm • Low-maintenance and low-particle by air bearing and direct drive With this aligner, second translational motions of ± 5 mm in the plane and a rotation around the vertical of ± 3° are realized. The motion R (Phi) is the result of the XY combination of axes. Specifications: - Travel: ± 5 mm (XY) / ± 3 mm (Rz) - Repeatability: ± 0.4 - ± 0.7 µm (XY) / ± 0.0002 - ± 0.0003 µm (Rz) - Positoning speed: 50 - 100 mm/s (XY) / 10 - 20 mm/s (Rz) - Max. load: 5 N (XY) / 100 N (Rz) - Aperture: 730 x 730 mm - Motor: Ironless Dynamic Linear Motor (XYRz) - Guide: Air Bearing (XYRz) - Feedback: Linear Encoder (XYRz) - Länge x Breite x Höhe: 990 x 1090 x 225 mm - Material: Anodized Aluminum Customized options: - Adaptation to the process: aperture, holder, feeder, extension of Z-Motion - Configuration for clean room ISO 14644-1 (up to class 1 on request) - Individual design with rack, vibration isolation, enclosure - Individual solution development with 3D design for the positioning task