Temperature testing machine HS-LDTS1000

performanceautomaticCNC

Overview
HS-LDTS1000 is an automated LD chip photoelectric performance tester designed for optoelectronic manufacturers to measure LIV and spectral parameters of front and back illumination of long-wavelength laser chips under sealed low-temperature conditions. The system integrates automated handling, intelligent vision algorithms, AOI appearance inspection and OCR to support production testing and quality control.

Key functions and capabilities

• Automated test sequences and high-level automation for inline or batch testing.
• AOI appearance inspection and OCR character recognition for front and end-face.
• LIV and spectral measurements at ultra-low, sealed temperatures.
• High throughput: typical cycle time ~4.5–6 s per piece (application dependent).

Application areas

• Photonics and optoelectronic component manufacturing
• Power device testing
• Microwave/RF device production
• New energy vehicle electronics

Technical parameters / testing scope

• Measurement of LIV and spectral parameters for front and back illumination of long-wavelength laser (LD) chips under ultra-low temperature sealed conditions.
• Supports front-face and end-face testing processes with AOI and OCR verification.
• Chip size range: minimum 0.15 x 0.2 mm; maximum 10.0 x 10.0 mm.
• Supported feed formats: 2" GEL-PAK and 6" wafer ring.

Advantages & notable features

• Proprietary temperature-control module with high-precision regulation suitable for ultra-low-temperature tests.
• High-precision vision system with re-inspection capability to ensure product quality stability.
• Feedstock compatibility with 2" GEL-PAK and 6" wafer ring.
• Rotary table with separate synchronized workstations to increase throughput.

Technical specifications

• Model: HS-LDTS1000
• Testing scope: LIV and spectral parameters for front/back illumination of long-wavelength LD chips at ultra-low temperatures
• Chip size handled: 0.15 x 0.2 mm (min) to 10.0 x 10.0 mm (max)
• Equipment efficiency: approximately 4.5–6 s per piece (application dependent)
• Feedstock formats: 2" GEL-PAK, 6" wafer ring
• Temperature control: proprietary high-precision design for sealed low-temperature testing
• Vision system: high-precision AOI with OCR and re-inspection support
• Mechanical design: rotary table with separate synchronized stations