Metal-coated diamond

custom-made

Overview
This material combines very high thermal conductivity with a relatively low coefficient of thermal expansion (CTE), enabling improved thermal management and CTE matching with semiconductor packages. Developed using TECNISCO's expertise, it is intended for reliable long-life performance in high-power applications and facilitates easy integration into existing package designs.

Features
Metal-diamond composites (Silver diamond) contribute to enhanced product performance, reliability and extended lifetime by offering:

• Excellent thermal conductivity
• CTE matched to packaging materials
• Easy integration of components into existing packages

Standard dimensions
Thickness: 1.0-5.0 mm
Length: Up to 200 mm
Width: Up to 200 mm

Surface Finish Process
Surface Roughness: Ra<0.01μm *
Flatness: <1μm *
Metallization: Cu, Ag
Coating: Ni, Ni/Au, Ag, Cu, AuSn

End user market / Applications

• Micro Electronics
  
  • Server CPU
  • Premium coolers
• Power Electronics
  
  • Battery cooling systems
  • Electric vehicles
• HF Electronics
  
  • Wireless communication
  • Data broadcast
• Medical
  
  • X-ray
  • Medical RF imaging

Other services
Vacuum hot press service
Sputtering targets
Laminated materials
Customization to customer requirements:

• Shape
• Thickness
• Various materials

ISO Management System Certificate
ISO9001
Registration Number: 01 100 1834602
Registration Date: April 29, 2025
Expiry Date: April 18, 2028
First Registration Date: April 19, 2022
Certification Authority: TÜV Rheinland

Characteristics / Technical specifications

• Material family: Metal diamond composites (Silver diamond)
• Thickness: 1.0-5.0 mm
• Maximum Length: Up to 200 mm
• Maximum Width: Up to 200 mm
• Surface Roughness: Ra<0.01μm (after coating + diamond milling)
• Flatness: <1μm (after coating + diamond milling)
• Metallization options: Cu, Ag
• Coating options: Ni, Ni/Au, Ag, Cu, AuSn