Copper sheet

Outline
This CuW submount is designed as a heat sink for high-power LD modules. It provides precise LD alignment, sharp edges and controlled warpage for effective thermal conduction. Excess solder during AuSn vapor deposition on the LD bonding area can be controlled.

Features
Materials
Composition: W90/Cu10
Thermal conductivity: 170 W/m・K
CTE (coefficient of thermal expansion): 6.5 ppm/℃

Dimension/Tolerance
Length: refer to the standard specifications below
Width: refer to the standard specifications below
Thickness: refer to the standard specifications below
Surface roughness: Ra <0.4
Warpage: ≤ 5.0 μm
Edge radius: ≥ 20.0 μm

Metallization
All surfaces: Ni 1.0–5.0 μm / Au 0.1–0.3 μm

AuSn solder
Composition: Au75/Sn25 (wt%)
Thickness: 5 μm ±1 μm

Options

• Material selection (W80/Cu20)
• Sputtering layer addition (Ti, Pt, Au etc.)
• Additional structures (hole, step, custom shape)

Standard specifications（Unit：mm）
Length (±0.05): 10.6
Width (±0.05): 2.0, 3.0, 4.0, 5.6
Thickness (±0.02): 0.20, 0.25, 0.30, 0.40

End user market / Applications
Industrial laser

• Laser systems for welding, cutting, marking, surface treatment (e.g. annealing)
• Medical laser systems (ophthalmology, hair removal) and endoscopes

Semiconductors

• Power semiconductor devices, MPUs and related components

Digital equipment

• Laser printers, digital multifunction printers and related devices

Technical specifications

• Composition: W90/Cu10 (optional W80/Cu20)
• Thermal conductivity: 170 W/m・K
• CTE: 6.5 ppm/℃
• Surface roughness: Ra < 0.4
• Warpage: ≤ 5.0 μm
• Edge radius: ≥ 20.0 μm
• Metallization: Ni 1.0–5.0 μm / Au 0.1–0.3 μm (all surfaces)
• AuSn solder composition: Au75/Sn25 (wt%)
• AuSn solder thickness: 5 μm ±1 μm
• Standard length: 10.6 mm (±0.05)
• Standard widths: 2.0, 3.0, 4.0, 5.6 mm (±0.05)
• Standard thicknesses: 0.20, 0.25, 0.30, 0.40 mm (±0.02)