IntroductionThe TR7700 SIII Ultra CI is a conformal coating inspection system for PCB assemblies that integrates multi‑phase lighting and high‑resolution dynamic imaging to detect coating defects, measure coating thickness and inspect flux and glue.
Key features- Conformal coating inspection for multiple PCB applications
- Smart programming with automatic coating area learning
- Optional high‑precision coating thickness measurement with laser sensor (35–750 μm)
- High‑throughput dynamic imaging with 4 Mpix top camera
- Flux and glue inspection capabilities
- Factory‑ready connectivity with real‑time SPC trends
Optical systemImaging method: Dynamic imaging
Top camera: 4 Mpix
Imaging resolution: 10 µm, 15 µm (factory setting)
Lighting: Multi‑phase RGB+W+UV LED
Coating thickness measurement (optional)Measuring range: 35 μm – 750 μm
Imaging performanceImaging speed: 60 cm²/sec (@10 µm); 120 cm²/sec (@15 µm)
Motion table & controlX‑Y‑Z axis: Ballscrew + AC servo with motion controller
Axis resolution: 1 µm
Board handlingMax PCB size: 500 x 460 mm (DL variants: 510 x 310 mm ×2 lanes; 510 x 590 mm ×1 lane)
PCB thickness: 0.5 – 5 mm
Max PCB weight: 3 kg (optional 5 kg)
Clearances: Top 25 mm (optional 50 mm); Bottom 40 mm; Edge 3 mm (optional 5 mm)
Conveyor: Inline; Height 880–920 mm; SMEMA compatible
Inspection functions- Component defects: missing; tombstoning; billboarding; polarity; rotation; shift; wrong marking (OCV); defective; upside down; extra component; foreign material; lifted component
- Solder joint defects: excess solder; insufficient solder; bridging; through‑hole pins; lifted lead; golden finger scratch/contamination
- Conformal coating defects: missing coating; insufficient coating; crack; bubble; splash; contamination; spill coating; thickness; glue height (3D laser)
Dimensions & weightWxDxH: TR7700 SIII Ultra CI: 1100 x 1720 x 1710 mm (DL: 1100 x 1820 x 1710 mm)
Weight: 940 kg (DL: 960 kg)
VideoEmbedded product video available demonstrating inspection workflows and optional coating thickness measurement.
Technical specifications- Model: TR7700 SIII Ultra CI
- Imaging method: Dynamic imaging
- Top camera: 4 Mpix
- Imaging resolution: 10 µm, 15 µm (factory setting)
- Lighting: Multi‑phase RGB+W+UV LED
- Coating thickness (optional): 35 μm – 750 μm
- Imaging speed: 60 cm²/sec (@10 µm); 120 cm²/sec (@15 µm)
- Motion: Ballscrew + AC servo with motion controller; X‑Y‑Z resolution: 1 µm
- Max PCB size: 500 x 460 mm (DL: 510 x 310 mm ×2 lanes; 510 x 590 mm ×1 lane)
- PCB thickness: 0.5 – 5 mm
- Max PCB weight: 3 kg (optional 5 kg)
- Clearances: Top 25 mm (opt. 50 mm); Bottom 40 mm; Edge 3 mm (opt. 5 mm)
- Conveyor: Inline; Height 880–920 mm; SMEMA compatible