Wire cutting machine SH200-R
diamondfor glassfor ceramics

Wire cutting machine - SH200-R - Vimfun Diamond Wire Saw - diamond / for glass / for ceramics
Wire cutting machine - SH200-R - Vimfun Diamond Wire Saw - diamond / for glass / for ceramics
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Characteristics

Technology
wire, diamond
Material
for glass, for ceramics
Product handled
slab, wafer
Control type
with control software
Applications
for microelectronics manufacturing
Workpiece loading
manual loading
Phase
three-phase
Configuration
large-format, with rotating table
Other characteristics
high-precision, heavy-duty, horizontal, rotary operated
Y travel

Max.: 2,000 mm
(78.74 in)

Min.: 1,000 mm
(39.37 in)

Z travel

550 mm
(22 in)

Cutting speed

60 m/s
(196.85 ft/s)

Laser power

6,000 W

Repeatability

0.02 mm
(0.0008 in)

Overall length

3,100 mm
(122 in)

Maximum width

2,300 mm
(91 in)

Height

2,100 mm
(83 in)

Weight

3,000 kg
(6,613.87 lb)

Power supply

220 V

Description

Product Overview
The HorizonCrystal SH200-R is an endless diamond wire saw designed for horizontal cutting of large quartz, crystal and technical ceramic workpieces. It supports workpiece diameters up to 2000 mm and heavy industrial loading, delivering fine surface quality and high throughput for production-scale slicing.

Key Features
  • Horizontal endless diamond wire saw architecture for large-diameter quartz and brittle/hard materials
  • Closed-loop (endless) diamond wire with unidirectional motion for stable cutting
  • High wire speed capability (typ. up to 60 m/s; some endless configurations support up to 84 m/s)
  • Superior surface finish with minimal kerf width (≈0.7 mm)
  • Heavy-duty frame allowing loading by forklift or overhead crane
  • Optional integrated rotary table (R-axis) to accelerate cutting and increase productivity
  • Adjustable cutting parameters to match material and thickness

Applications
  • Semiconductor industry: slicing quartz, ceramics and crystal substrates for wafers and chips
  • Optoelectronics: shaping synthetic sapphire and crystal components for LEDs and lasers
  • Ceramic and advanced materials: alumina, SiC, zirconia, boron nitride, mullite, sialon, Macor
  • Jewelry and luxury goods: cutting large gemstones and sapphire glass for watches and displays
  • Scientific research: precision cutting of varied crystal materials

Equipment Advantages
  • High cutting efficiency due to diamond abrasive wire and elevated linear speeds
  • Excellent surface quality from continuous endless wire motion
  • Reduced material waste thanks to narrow kerf and thin wire diameter (0.35–0.8 mm)
  • Robust design for direct handling of large, heavy workpieces
  • High precision with repeat positioning accuracy ±0.02 mm on Y and Z axes
  • Rotary axis option for smoother, faster multi-pass operations

Technical Specifications
  • Model: SH200-R
  • Maximum workpiece diameter: 2000 mm (2 m)
  • Maximum workpiece height: no limit (application dependent)
  • Worktable Y-axis travel: 1000 mm (2000 mm with R-axis)
  • Worktable Z-axis travel: 550 mm
  • Maximum diamond wire speed: up to 60 m/s (typ.), up to 84 m/s in specific endless configurations
  • Minimum feed increment (Y & Z): 0.01 mm
  • Repeat positioning accuracy (Y & Z): ±0.02 mm
  • Total power consumption: 6 kW
  • Power supply: AC220V 50Hz (three-phase, five-wire)
  • Equipment dimensions (L×W×H): ≈ 3100 × 2300 × 2100 mm
  • Total weight: ≈ 3000 kg

Additional Notes
The closed-loop endless diamond wire enables high linear speeds and consistent surface finish. The machine is supplied with a loading station suitable for heavy industrial pieces; custom loading tables and software options are available to meet specific production requirements.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.