Diamond wire cutting machine SGSM 40

oscillating bladewaferstrap

High-Efficiency Endless Diamond Wire Saw for Sapphire & Superhard Materials




SGSM 40 – Swinging Endless Diamond Wire Cutting MachineWhen cutting sapphire, quartz, silicon carbide, or optical glass, surface quality, cutting stability, and productivity are critical.
The SGSM 40 Endless Diamond Wire Cutting Machine with Swinging Function is specifically engineered to meet these demands, offering a faster, smoother, and more reliable cutting solution than traditional wire saws.


Designed to Solve Real Cutting Challenges

Traditional reciprocating wire saws often suffer from:

Slow cutting speed

Visible wire marks on the cut surface

High vibration and frequent wire replacement

Unstable quality when cutting extremely hard materials

The SGSM 40 addresses these problems at the source by combining endless diamond wire technology with an active wire swinging system.




Endless Diamond Wire – Faster Cutting, Longer Wire Life
The SGSM 40 uses a closed-loop (endless) diamond wire that runs continuously in a single direction.
Unlike conventional back-and-forth wire systems, there is no direction reversal, which means:

Higher wire linear speed for faster cutting

Stable cutting force throughout the entire process

Significantly reduced vibration

Longer wire service life and lower consumable cost

This makes the SGSM 40 an ideal solution for high-value materials, where yield and surface quality directly affect production cost.








Swinging Wire Function – Better Surface Finish, Higher Efficiency
A major advantage of the SGSM 40 is its adjustable wire swinging (oscillation) function.
During cutting, the guide wheels move the wire up and down with a programmable amplitude, allowing cutting and micro-grinding to occur simultaneously.
This results in:
Faster material removal on superhard materials
Improved coolant penetration and chip evacuation
Reduced cutting stress and subsurface damage
Noticeably smoother cutting surfaces, especially on sapphire and SiC
For customers targeting optical-grade surface quality, this function delivers a clear competitive advantage.




Built for Precision, Stability, and Industrial Reliability
Rigid gantry structure ensures stable cutting even at high speeds
Servo-driven motion and precise tension control maintain cutting accuracy
Designed for both R&D environments and production workshops
Easy operation with PLC control and built-in safety protection
Whether for batch slicing or demanding precision applications, the SGSM 40 provides consistent and repeatable results.




Typical Applications

Sapphire wafers and optical components

Quartz and high-purity optical glass

Silicon carbide (SiC) and advanced ceramics

Semiconductor and electronic materials

Precision material research and industrial cutting

Upgrade Your Cutting ProcessIf you are looking to:

Increase cutting efficiency

Improve surface finish quality

Reduce wire consumption and operating cost

Cut extremely hard materials with confidence

The SGSM 40 Endless Diamond Wire Cutting Machine with Swinging Function is the solution designed for your needs.


Contact us today to discuss your material type, cutting size, and process requirements.
Customized configurations and cutting tests are available upon request.