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Diamond wire cutting machine SVI30-30for composite materialsprofilecontour
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Characteristics
- Technology
- diamond wire
- Material
- for composite materials
- Product handled
- profile, contour
- Control type
- with programming software
- Associated function
- multi-function
- Applications
- for process industry, for the semiconductor industry
- Workpiece loading
- manual loading
- Phase
- three-phase
- Configuration
- 2-axis
- Other characteristics
- precision
- X travel
300 mm
(11.81 in)- Y travel
300 mm
(11.81 in)- Cutting speed
84 m/s
(275.591 ft/s)- Laser power
7,500 W
- Operating pressure
0.6 MPa
- Overall length
300 mm
(12 in)- Maximum width
300 mm
(12 in)- Height
300 mm
(12 in)- Power supply
380 V
Description
The SVI30-30 is our Small size diamond wire cutting saw for complex profile cut.it is capable to cut all kind of material softer than diamond.
The SVS30-30 is an advanced circular diamond wire cutting machine. It utilizes a circular diamond wire as its cutting tool. This equipment offers basic slicing capabilities and can be upgraded to perform precision contour cutting. With a remarkable maximum cutting line speed of 84m/s, it delivers exceptional sharpness and outperforms alternative cutting methods in terms of both speed and surface quality.
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Catalogs
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Ceramic Cutting
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.