Silicon nitride ball

Overview
Innovacera Silicon Nitride grinding media balls are manufactured by three forming methods: titration, roll forming and CIP (cold isostatic pressing). They are gas-pressed and sintered at 1800–2100 °C. The silicon nitride purity is approximately 99%. For diameters greater than 3 mm, CIP forming is commonly selected. Main diameter range: 0.2 mm – 20 mm.

Key features

• Chemical inertness
• Low friction and low heat generation
• Electrical insulation
• Non-magnetic
• High mechanical strength
• Corrosion resistance

Advantages compared with other grinding media
Si3N4 milling balls deliver higher wear resistance and lower contamination, improving energy efficiency and reducing mechanical wear. They enable ultra-fine grinding and efficient dispersion, making them suitable for high-purity applications such as semiconductor slurries, pharmaceutical dispersions and battery material milling.

Si3N4 milling ball general size
Main size: 0.2 mm – 20 mm.
Specification (mm):
0.2-0.4 | 0.4-0.6 | 0.6-0.8 | 0.8-1.0 | 1.0-1.2
1.4-1.6 | 1.6-1.8 | 1.8-2.0 | 2.0-2.2 | 2.2-2.4
2.4-2.6 | 2.6-2.8 | 2.8-3.0 | 3.0-3.5 | 3.5-4.0
4.0-4.5 | 4.5-5.0 | 5.0-5.5 | 5.5-6.0 | 6.0-6.5
6.5-7.0 | 7.0-7.5 | 7.5-8.0 | 8.0-8.5 | 8.5-9.0
9.0-9.5 | 9.5-10.0 | 10.0-10.5 | 10.5-11.0 | 11.0-11.5
11.5-12.0 | 12.0-12.5 | 12.5-13.0 | 13.0-13.5 | 13.5-14.0
14.0-14.5 | 14.5-15.0 | 15.0-15.5 | 15.5-16.0 | 16.0-16.5
16.5-17.0 | 17.0-17.5 | 17.5-18.0 | 18.0-18.5 | 18.5-19.0
19.0-19.5 | 19.5-20.0

Applications

• Ceramics manufacturing
• New energy (battery materials)
• Electronic materials milling
• Grinding inks, rare earth oxides and advanced polymers
• High-purity chemical systems grinding

Technical specifications

• Material: Silicon nitride (Si3N4)
• Purity: ~99%
• Forming methods: titration, roll forming, CIP (cold isostatic pressing)
• Sintering: gas-press sintering at approximately 1800–2100 °C
• Recommended forming: CIP commonly used for diameters > 3 mm
• Available size range: 0.2 mm to 20 mm (multiple discrete ranges listed above)
• Typical properties: chemical inertness, low friction/heat generation, electrical insulation, non-magnetic, high strength, corrosion resistance
• Typical uses: semiconductor slurries, pharmaceutical dispersions, battery material milling, inks, rare earths, advanced polymers and other high-purity grinding applications