Cold plate Thermal-controlled Phase-change Materials

The heat flux density of electronic devices is often unevenly distributed. However, this problem cannot be effectively solved by the phase-change cold plate by relying on the traditional enhanced heat transfer method. To overcome the difficulty, the ultra-thin heat pipes,ultra-thin temperature equalizing plates and other high thermal conductivity components are integrated with the phase-change cold plates in the design and manufacture, which ensures that the heat can be evenly distributed to the entire cold plate, the utilization of phase-change materials is maximized, and the temperature uniformity of the cold plate in the case of limited space and weight can be significantly improve,with the temperature gradient of single plate controlled within 5°C.