Han's Laser materials processing laser sources

Power: 280 W - 320 W
Wavelength: 9.2 µm - 10.8 µm

... on printed circuit boards, flexible PCB processing, precision plastic cutting, pork/meat marking, 3D printing support processes, ceramic scribing & drilling, glass cutting and cladding, backlight panel processing, ...

Power: 80 W - 200 W
Wavelength: 9.2 µm - 10.8 µm

... phone housings; microvia processing for printed circuit boards and flexible PCBs; precision plastic cutting; glass cutting and cladding; marking and processing of non‑metallic materials ...

Power: 80 W - 200 W
Wavelength: 9.2 µm - 10.8 µm

... compatibility with laser heads and processing systems for varied industrial workflows

Applications
Ceramic scribing, drilling and engraving; microvia machining for printed circuits and flexible ...

Power: 500 W

... high-power model within HFM series)

Power: 20 W - 100 W

... Series delivers stable high-power laser output while achieving a substantial improvement in peak power. It is designed for laser processing tasks that require high peak power, such as glass cutting and ...

Power: 200 W - 350 W

... overview
The HFM-K Series is a pulsed fiber laser line with average output power from 200–350W, engineered for high-speed marking, precision cutting, welding and a range of material- processing ...

Power: 20 W
Wavelength: 1,030 nm

... Overview

• The Femto-10 is a medium-power femtosecond pulsed laser engineered for high-precision micromachining, cutting, marking and thin-film patterning in industrial production environments.

Power: 80 W
Wavelength: 1,064 nm

... providing stable output (power stability ≤3% over 24 h) and improved machining performance for semiconductor and photovoltaic processing

Power: 20 W - 50 W
Wavelength: 1,030 nm

... >Near-diffraction-limited beam quality