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We can provide many kinds of heatsink for the thermoelectric cooling system and also can provide the custom design. Please do not hesitate to contact us if you have any requirment.
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Master Bond Inc. offers a broad line of electrically and thermally conductive adhesives, sealants, coatings and potting compounds which are widely used in the electronic, aerospace, optical and electrical industries. They are formulated with ceramic and metal powders/flakes such as silver, nickel, copper, graphite, boron nitride, aluminum nitride, aluminum oxide and silver-coated nickel. Our line includes electrically and thermally conductive epoxies, silicones and rubber based compounds. They feature excellent conductivity along with good physical strength and/or ease manufacturability
Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. Compounds are available in hundreds of grades to meet your specific requirement. These vary from high strength, general purpose adhesives, sealants and coatings systems to highly specific “tweaked” applications. Master Bond invites you to take advantage of our “one on one" support policy offering prompt technical assistance from our professional staff. They have years of experience, and will assess your problem and work with you throughout the design, prototype and manufacturing process.
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Advanced's new line of RoHS Compliant image sensor sockets is designed to reduce costs by protecting valuable sensors from damage during board assembly and processing.
Standard, footprint-specific and custom configurations are available for virtually any application from digital cameras to security systems to satellite imaging. As with any socket from Advanced, you can count on the highest quality screw-machined terminals and industry-proven multi-fingered contacts for long-term durability in even the most demanding applications.
Featured with :
- Protect sensor performance by inserting after the reflow soldering process.
- Eliminate the chance for damage to valuable sensors during board assembly caused by prolonged exposure to heat and errant solder flux on glass components.
- Reduce costs by eliminating the need for glass cleaning operations.
- Plan for device shortages or future upgrades by designing a socket onto your board.
- Molded insulators available on custom orders.
- Available with Gold/Gold or Matte Tin/Gold plating for lead-free compatible processing.
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PLCC Sockets
* Low profile housing
* Seven different sizes - 20-84 pole
* Available in tubes or taped
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Wide-open cover enabling visual check of IC
Mis-insertion preventing mechanism adopted for the cover
Slide-lock function
Low-profile design improving IC inductance
RoHS compliant
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Hermetically sealed packages for the microelectronics industry are hermetic containers which protect the critical microelectronics and components utilized within our industries HCC's microelectronic packages seal and protect delicate circuitry and use sophisticated metals and engineered designs that quickly dissipate heat to allow the devices inside to operate optimally. For example, the Company supplies a primary defense contractor with microelectronic packages that house vital electronics.
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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions.
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CPU Cooling Fans SAN ACE MC
Liquid Cooling System SAN ACE MC Liquid
SAN ACE MC Series is a low-noise, low-vibration cooling fan with superior head dissipation for efficient PC CPUs .
Sanyo Denki offers a complete product lineup of CPU coolers for Intel(R) Pentium(R) Processors. Please consult us for the latest models.
The SAN ACE MC Liquid Series is a high-performance liquid cooling system for CPUs with high clock speeds and extreme heat generation.
The device consists of a radiator, a reserve tank, a pump and a cooling fan.
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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions.
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Hynix plans to manufacture MCP, a combination of flash memory and SRAM in a single package, from the second half of this year to capitalize on the synergies from its flash and SRAM products. Taking the best from the two chips, the MCP chip boasts fast processing speeds combined with low power consumption.
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Samsung’s MCP portfolio leverages the company’s expertise in memory design and semiconductor process technologies. Its MCPs are built using its lowpower memory technology so that mobile devices will consume as little power as possible. In addition, Samsung’s core MCP technology utilizes the company’s skills in wafer thinning, same-die stacking, wire bonding – chip to chip and long-wire bonding – and molding.
The memory chips included in Samsung MCPs are built using advanced process technologies – from 90 to 65 nanometers. The company’s ongoing investments in fabs and technology assure customers of MCPs that will stay on the leading edge.
One of the many advantages of Samsung MCPs is the consistent use of the
same packaging and footprint, which makes it easy to scale between different Samsung MCP combinations. In addition, Samsung customers are assured of broad options within the same footprint.
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Master Bond Inc. offers a complete line of environmentally friendly conformal coatings that are easy to apply and provide superior protection for printed circuitry. These conformal coatings include very fast, one part, UV curing formulations, one and two part epoxies, one and two part silicones and a unique, cost effective latex system. These electronics coatings can be applied by spraying, dipping, flow coating and other conventional processing techniques. Master Bond Inc. will be glad to recommend specific products for your particular application.
Where rapid cure speeds are of prime importance, we offer one part, UV curable systems. For intricate parts with shadowed-out areas, we also offer special "dual cure" coatings which cure with UV light and with the addition of heat. Grades vary in viscosity, cure speed, flexibility, chemical and temperature resistance, electrical properties, color, etc. Special formulations are non-yellowing, optically clear, cryogenically serviceable, repairable and have exceptional dielectric properties. Ultra low viscosity coatings are available for confined spaces.
For easy application and reliable performance, select Master Bond for your conformal coating needs. Our wide range of compounds will extend the life of your electronic assemblies and provide protection against moisture, abrasion, solvents, and elevated temperatures. They are 100% reactive and contain no solvents or diluents. For over 30 years, manufacturing companies worldwide have depended on Master Bond's job-proven compounds.
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HPA Conformal Coating
Ref: HPA
Resistant to mould growth
May be removed with solvents such as Ultrasolve (ULS)
UV trace for inspection
Excellent dielectric properties and with a wide temperature range
Approved to US MIL-1-46058C
China Military Approval GJB150 and GJB4 (Naval)
For professional use only
Acrylic Protective Lacquer
Ref: APL
Offers excellent adhesion to all substrates
UV trace for inspection
May be removed with solvents such as Ultrasolve (ULS)
Wide temperature range and good dielectric properties
May be soldered through, allowing for repair
For professional use only
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Our screw-machined PGA socket and adapter terminals come in a multitude of footprints, including interstitial, and can be custom-engineered to meet specific requirements.
Featured with :
- durable construction for virtually any application
- wide variety of materials, lengths and sizes
- cost-effective method for replacing, repairing, or upgrading PGA devices
- RoHS Compliant insulators and terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating
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Master Bond Inc. offers a broad line of potting and encapsulation materials designed to protect electronic circuitry and assemblies from potentially damaging conditions such as moisture, various corrosive chemicals, excessive heat, vibration, mechanical impact, thermal shocks and abrasion which might occur while the device is in operation. While the majority of the products offered are epoxies, including both rigid and flexible types, other systems are also available such as polyurethanes and silicone compounds. These systems include two part systems that cure at ambient temperatures or more quickly at elevated temperatures, as well as one part, no mix systems requiring elevated temperature cures. Master Bond's potting and encapsulation epoxies feature outstanding electrical insulation characteristics including high volume resistivity, excellent dielectric strength and low dielectric constants and dissipation factors. Some of the more specialized compounds include epoxies that are flame resistant, thermally conductive and cryogenically serviceable. Master Bond's technical staff will be glad to recommend the product best suited to your particular application's requirements.
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Customers around the world continue to rely on Bivar’s manufacturing and design strength when it comes to Optoelectronics (standard and custom) and Assembly Hardware.
We’re evolving to meet the increased demand for Solid State Lighting (SSL) with the introduction of our directional lighting series that addresses a growing range of industrial markets and applications.
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Nuloc: Hypertac interconnect’s solution for ERTMS.
Hypertac innovated by integrating into the Nuloc interconnection system a unique recognition code for each locomotive and by adapting the cable antenna dimension to each locomotive type.
The coding function is generated on an embedded printed circuit inside the connector receptacle. The code is programmed during the final manufacturing phase. This code is the “DNA signature” given to each SNCF locomotive that will ensure the reliability of the unique train identification on the European rail network system management.
The interconnection system also integrates a coaxial cable assembly to link to the antenna. ERTMS being a retrofit on the existing equipments, each cable assembly must be dimensioned to the locomotive type. This is done during the manufacturing process according to the instructions specific to each order.
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4" Schottky Wafer
Die Size VR IF VF
68 mil 40 V 5A 0.54V
68 mil 60 V 5A 0.65V
68 mil 100 V 5A 0.83V
76 mil 40 V 8A 0.54V
76 mil 60 V 8A 0.65V
76 mil 100 V 8A 0.85V
84 mil 40 V 10A 0.55V
84 mil 60V 10A 0.73V
84 mil 100 V 10A 0.85V
and more....., please contact with Ms. Cindy Lin through her email add.: cindy.lin@eris.com.tw
Best Regards,
Eris Technology Corporation
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We can provide high purity of Te, Be, Sb, from 99.999% to 99.9999%.Please do not hesitate to contact us,if you have any requirment.
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Compound Semiconductor Materials
The products comply with RoHS Directive. (December 2005)
Nichia deal in high purity "Ga" metals. And we have infrared epitaxial wafers which are used in high power and high-speed infrared LEDs.
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Our high quality, dependable DIP and SIP sockets and adapters accommodate applications from surface mount to through-hole.
Featured with :
- automated assembly compliant
- wide range of patterns and terminal styles, from 8 pin to 64 pin
- available with Tape Sealed terminals
- RoHS Compliant insulators and terminals are compatible with lead-free processing - select either Matte Tin or Gold plating
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For relays with forcibly guided contacts which are particularly adapted to suit the relay characteristics, ELESTA relays can provide sockets for relay series and accessories for DIN rails using both screw and PCB mounting.
- SRD-SGR2 DIN rail socket for relay series SGR282Z and SIR282
- SRD-SGR2 DIN PCB socket for relay series SGR282Z and SIR282
- SRD-SIM4 Manipulation-protected DIN rail socket for relay series SIM3 and SIM4
- SRD-SIM4 Manipulation-protected PCB socket for relay series SIM3 and SIM4
- SRD-SIM4 Manipulation-protected PCB socket for relay series SIR4 and SIR4 SEN
- SRP-SIM4 Manipulation-protected PCB socket for relay series SIR6 and SIR4 SEN
- Approvals: UL, cUL,
Areas of application: lifts, machine tools, lifting technology, transportation
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Advanced Interconnections invented the world's first, flexible, removable terminal carrier. Made from a RoHS Compliant polyimide film carrier that acts as its own insulator, Peel-A-Way® is a versatile, patented design that can be produced in many configurations including PGA, DIP, SIP, and Board to Board. The flexible design and removable feature allow for increased air flow and total visual inspection of solder joints.
Featured with :
- Board to Board applications on tight spacing as low as .050" (1.27mm)
- available in sheets for multiple terminal loading across the PCB
- wide range of patterns and terminal styles
- removable film carrier allows for low profile device mounting
- works with thru-hole and surface mount technology
- RoHS Compliant insulators and terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating
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Advanced® Adapters provide high quality, proven solutions for IC package conversion and test emulation applications. We offer a wide variety of standard adapters, including PLCC with patented Murphy Circuits®, SOIC, and BGA. New designs available for lead-free RoHS compliant applications.
Featured with :
- wide variety of standard solutions including SOIC to DIP or PLCC to PGA
- common and custom from-to configurations
- design solutions for device package transition (ex. PGA to PQFP)
- device enhancements or corrections by adding passive components
- complete surface mount facility in-house for turn-key solutions
- Full line of Sunhayato%u2122 Test Emulator and Package Conversion Adapters available exclusively from Advanced
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Features:
Single switch logic board
Supports single & bicolor LEDs
Panel mount capabilities
Compatible with C1601 controller
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The Bergquist Company is the world leader in the development and manufacture of thermally conductive interface materials. Thermal Clad Insulated Metal Substrate (IMS®) was developed by Bergquist as a thermal management solution for today's higher watt-density surface mount applications where die size is reduced and heat issues are a major concern.
Thermal Clad Benefits Include:
Lower operating temperature
Reduce printed circuit board size
Increase power density
Extend the life of dies
Reduce the number of interconnects
Improve product thermal and mechanical performance
Combine power and control
Improve product durability
Enable better use of surface mount technology
Reduce heat sinks and other mounting hardware including thermal interface material
Replace fragile ceramic substrates with greater mechanical durability
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Materials and mountings for electronics
