Protective film FS-A101

thermal conductorconductivepolymer

Product overview
FS-A101 is a sintering bonding film in which sinterable silver particles are dispersed at high concentration in an organic matrix. The film is stable at room temperature, flexible with controlled thickness, and designed for straightforward handling and high material yield. The organic matrix provides tackiness for pre-bonding without additional adhesives. After sintering, the layer yields uniform, smooth silver-based conductive results with high thermal and mechanical reliability.

Features

• Thickness-controlled flexible film storable at room temperature
• Easy handling with good workability and high material yield ratio
• Designed tackiness enables pre-bonding without extra adhesive
• Sintering achievable without preheating to avoid bleed or unevenness
• After sintering, exhibits heat and electrical conductivity characteristic of silver (Ag)
• Robust reliability with excellent thermal resistance and mechanical properties

Structure
Standard precursor layer thickness before sintering: 50 μm (customizable on request).

Applications
Bonding of semiconductors using silver sintering (sintering bonding); suitable for processes requiring a conductive, thermally resistant joint after sintering.

Technical specifications

• Model: FS-A101
• Form: Sintering bonding film (organic matrix with dispersed sinterable silver particles)
• Precursor layer standard thickness (before sintering): 50 μm (customizable)
• Storage: Stable at room temperature
• Handling: Flexible with controlled thickness and easy handling
• Tackiness: Organic matrix provides tackiness for pre-bonding without additional adhesive
• Sintering: Uniform, smooth sintered layer achievable without preheating; designed to avoid bleeding
• Properties after sintering: Thermal and electrical conductivity of Ag; excellent thermal resistance and mechanical strength
• Workability: Good material yield ratio