Protection adhesive tape ELEP HOLDER™

removablefor wafers

Overview
Low-adhesion release and UV-release types designed to support wafer backgrinding processes. Suitable as a protective/handling support during backside thinning of wafers.

Line-up
Product lineup and product structure are presented on the original page as an illustrated table or figure showing the available variants and layer structure.

Caution

• Avoid skin contact; contact may cause skin rashes.
• Dispose of product through a certified disposal company. Do not incinerate: burning may generate toxic gases or odors that can cause nausea if inhaled.

Characteristics / Technical specifications

• Product type: Backgrinding tape for wafer processing
• Model / series: ELEP HOLDER™
• Release types: Low-adhesion release; UV-release
• Application: Supports wafer backgrinding/backside thinning processes
• Main features: Release control via low-adhesion liner and UV-triggered release to facilitate debonding after grinding
• Safety: May cause skin irritation on contact; follow certified disposal procedures; do not incinerate
• Brand / Manufacturer: Nitto