Mounting adhesive tape ELEP MOUNT™

filmfor wafersfor electronics

Overview
This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.

Features

• Outstanding pick-up performance with a 50µm thick chip.
• Enables wafer mounting at 40°C.
• Integrated with pressure-sensitive dicing tape.
• Enables label shaping.

Structure
Structure illustrated by product structure diagram (visual representation available on product page).

Properties

Table - Chip size / Thickness [µm] / Wafer size [mm] / Surface flatness / Line-up / Supply form / Properties:
C/C (chip type) >2 mm / Thickness: 10-40 µm / Wafer size: 200, 300 mm / Surface flatness: Flat / Line-up: EM-700 series (non-cure) / Supply form: Precut/Non-precut
Small (chip type) / Thickness: 10-40 µm / Wafer size: 200, 300 mm / Surface flatness: Flat / Line-up: EM-310/400 series (cure) / Supply form: Precut/Non-precut
C/S (chip type) / Thickness: 10-40 µm / Wafer size: 200, 300 mm / Surface flatness: Rough / Line-up: EM-310/400 series (cure) / Supply form: Precut/Non-precut

Application & Benefits

• Fixing IC chips to lead frames or interposers in semiconductor assembly.
• Improves adhesive reliability in BOC and stacked CSP manufacturing.
• Prevents silver paste bleeding that can cause short circuits.
• Enables integration into a continuous dicing process when combined with fixing tape.

Caractéristiques / spécifications techniques

• Series / Model family: ELEP MOUNT™ (EM Series)
• Typical film thickness range: 10–40 µm
• Supported wafer sizes: 200 mm, 300 mm
• Supply forms: Precut / Non-precut
• Line-up examples: EM-700 series (non-cure); EM-310 / EM-400 series (cure)
• Surface flatness options: Flat (for C/C and small chips), Rough (for C/S)
• Pick-up performance: Designed to pick up 50 µm thick chips
• Operating temperature for wafer mounting: Enables mounting at 40°C
• Integrated function: Combined with pressure-sensitive dicing tape for dicing and die attach in continuous processes
• Primary application: Die attach for IC chips on lead frames and interposers; suitable for BOC and stacked CSP processes