Overview Low-adhesion release and UV-release. Characteristics support the dicing process of wafer manufacturing.
Line-up Product belongs to the Dicing Tape line-up; structure and lineup are illustrated in the product images.
Caution - Avoid skin contact to prevent irritation or rashes.
- For disposal, contact a certified waste management company. Do not incinerate; combustion may release toxic gases or odors causing nausea if inhaled.
Characteristics / technical specifications - Brand: Nitto
- Model: ELEP HOLDER
- Product family: Dicing Tape
- Release types: Low-adhesion release; UV-release
- Intended use: Supports wafer dicing processes in semiconductor manufacturing
- Reference: see product images for structure and lineup